Datasheet

LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 139 of 155
NXP Semiconductors
LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
14. Package outline
Fig 50. Package outline LBGA256 package
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC
MO-192
JEITA
- - - - - -
SOT740-2
SOT740-2
05-06-16
05-08-04
UNIT
A
max
mm 1.55
0.45
0.35
1.1
0.9
0.55
0.45
17.2
16.8
17.2
16.8
A
1
DIMENSIONS (mm are the original dimensions)
LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm
X
A
2
b D E e
1
e
1
15
e
2
15
v
0.25
w
0.1
y
0.12
y
1
0.35
1/2 e
1/2 e
A
A
2
A
1
detail X
D
E
B
A
ball A1
index area
y
y
1
C
C
AB
A
B
C
D
E
F
H
K
G
J
L
M
N
P
R
T
2 4 6 8 10 12 14 16
1 3 5 7 9 11 13 15
ball A1
index area
e
e
e
1
b
e
2
C
C
∅ v
M
∅ w
M
0
5 10 mm
scale