Datasheet

LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 140 of 155
NXP Semiconductors
LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 51. Package outline of the TFBGA180 package
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT570-3
SOT570-3
08-07-09
10-04-15
UNIT
mm
max
nom
min
1.20
1.06
0.95
0.40
0.35
0.30
0.50
0.45
0.40
12.1
12.0
11.9
12.1
12.0
11.9
0.8 10.4 0.15 0.12
A
DIMENSIONS (mm are the original dimensions)
TFBGA180: thin fine-pitch ball grid array package; 180 balls
0 5 10 mm
scale
A
1
A
2
0.80
0.71
0.65
b D E e e
1
10.4
e
2
v w
0.05
y y
1
0.1
ball A1
index area
B
A
D
E
C
y
C
y
1
X
A
B
C
D
E
F
H
K
G
L
J
M
N
P
2468101214
135791113
b
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
∅ v
M
C∅ w
M
ball A1
index area
detail X
A
A
2
A
1