Datasheet

LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 141 of 155
NXP Semiconductors
LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 52. Package outline of the TFBGA100 package
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT926-1 - - - - - - - - -
SOT926-1
05-12-09
05-12-22
UNIT
A
max
mm 1.2
0.4
0.3
0.8
0.65
0.5
0.4
9.1
8.9
9.1
8.9
A
1
DIMENSIONS (mm are the original dimensions)
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
A
2
b D E e
2
7.2
e
0.8
e
1
7.2
v
0.15
w
0.05
y
0.08
y
1
0.1
0 2.5 5 mm
scale
b
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
∅ v
M
C∅ w
M
ball A1
index area
A
B
C
D
E
F
H
K
G
J
24681013579
ball A1
index area
B A
E
D
C
y
C
y
1
X
detail X
A
A
1
A
2