Datasheet

LPC4350_30_20_10 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 4.2 — 18 August 2014 145 of 155
NXP Semiconductors
LPC4350/30/20/10
32-bit ARM Cortex-M4/M0 microcontroller
Fig 56. Reflow soldering of the LQFP144 package
SOT486-1
DIMENSIONS in mm
occupied area
Footprint information for reflow soldering of LQFP144 package
Ax
Bx
Gx
Gy
Hy
Hx
AyBy
P1P2
D2 (8×) D1
(0.125)
Ax Ay Bx By D1 D2 Gx Gy Hx HyP1 P2 C
sot486-1_fr
solder land
C
Generic footprint pattern
Refer to the package outline drawing for actual layout
23.300 23.300 20.300 20.3000.500 0.560 0.2801.500 0.400 20.500 20.500 23.550 23.550