Datasheet

DRAFT DRAFT DRAFT DR DRAFT DRAFT DRAFT
D
RAF
DRAFT DRAFT DRA
F
T D
RAFT DR
AFT D
DRA
F
T DRAFT DRAFT
D
RAFT
DRAFT
D
RAFT
DRA
LPC82x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 0.11 — 26 August 2014 4 of 81
NXP Semiconductors
LPC82x
32-bit ARM Cortex-M0+ microcontroller
5. Marking
The HVQFN33 packages typically have the following top-side marking:
82xJ
xx xx
yywwxR
The TSSOP20 packages typically have the following top-side marking:
LPC82x
Mx01J
xxxxxxxx
zzywwxR
In the last line, field ‘y’ or ‘yy’ states the year the device was manufactured. Field ‘ww’
states the week the device was manufactured during that year. Field ‘R’ states the chip
revision.
Fig 1. TSSOP20 package marking Fig 2. HVQFN33 package marking
aaa-014766
Terminal 1 index area
NXP
1
20
aaa-014382
Terminal 1 index area
NXP