Datasheet
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Analog Integrated Circuit Device Data
Freescale Semiconductor 11
MC13892
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings Symbol Value Unit
ELECTRICAL RATINGS
Charger and USB Input Voltage
(5)
V
CHRGR
-0.3 to 20 V
MODE pin Voltage
V
MODE
-0.3 to 9.0 V
Main/Aux/Keypad Current Sink Voltage
V
LEDMD,
V
LEDAD,
V
LEDKP
-0.3 to 28 V
Battery Voltage
V
BATT
-0.3 to 4.8 V
Coin Cell Voltage
V
LICELL
-0.3 to 3.6 V
ESD Voltage
(6)
Human Body Model - HBM with Mode pin excluded
(9)
Charge Device Model - CDM
V
ESD
±1500
±250
V
THERMAL RATINGS
Ambient Operating Temperature Range
T
A
-40 to +85 °C
Operating Junction Temperature Range
T
J
-40 to +125 °C
Storage Temperature Range
T
STG
-65 to +150 °C
THERMAL RESISTANCE
Peak Package Reflow Temperature During Reflow
(7)
,
(8)
T
PPRT
Note 8
°C
Notes
5. USB Input Voltage applies to UVBUS pin only
6. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω) and the Charge Device
Model (CDM), Robotic (CZAP
= 4.0 pF).
7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
9. Mode Pin is not ESD protected.
Table 4. Dissipation Ratings
Rating Parameter Condition Symbol VK Package VL Package Unit
Junction to Ambient Natural Convection Single layer board (1s)
R
θJA
104 65 °C/W
Junction to Ambient Natural Convection Four layer board (2s2p)
R
θJMA
54 42 °C/W
Junction to Ambient (@200 ft/min) Single layer board (1s)
R
θJMA
88 55 °C/W
Junction to Ambient (@200 ft/min) Four layer board (2s2p)
R
θJMA
49 38 °C/W
Junction to Board
R
θJB
32 28 °C/W
Junction to Case
R
θJC
29 22 °C/W
Junction to Package Top Natural Convection
θJT 7.0 5.0 °C/W