Datasheet

Analog Integrated Circuit Device Data
Freescale Semiconductor 25
33886
5.0 A H-BRIDGE
THERMAL ADDENDUM - REVISION 2.0
Figure 26. Device on Thermal Test Board R
θJA
Figure 27. Transient Thermal Resistance R
θ
JA
Device on Thermal Test Board Area A = 600 (mm
2
)
0
10
20
30
40
50
60
Heat spreading area
A
[mm²]
Thermal Resistance [ºC/W
]
0 300 600
x
R
θ JA
0.1
1
10
100
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
time[s]
Thermal Resistance [ºC/W]
Time(s)
x
R
θ JA