Freescale Semiconductor Technical Data Document Number: MC33887 Rev. 16.0, 10/2012 5.0 A H-Bridge with Load Current Feedback 33887 The 33887 is a monolithic H-Bridge Power IC with a load current feedback feature making it ideal for closed-loop DC motor control. The IC incorporates internal control logic, charge pump, gate drive, and low RDS(ON) MOSFET output circuitry. The 33887 is able to control inductive loads with continuous DC load currents up to 5.
INTERNAL BLOCK DIAGRAM INTERNAL BLOCK DIAGRAM CCP CHARGE PUMP EN 8 μA (EACH) CURRENT LIMIT, OVERCURRENT SENSE & FEEDBACK CIRCUIT 5.0 V REGULATOR OUT1 IN1 IN2 D1 D2 VPWR GATE DRIVE 25 μA CONTROL LOGIC OUT2 OVER TEMPERATURE FS UNDERVOLTAGE FB AGND PGND Figure 2.
PIN CONNECTIONS PIN CONNECTIONS Tab AGND FS IN1 V+ V+ OUT1 OUT1 FB PGND PGND 1 20 2 19 3 4 18 17 5 16 6 7 15 14 8 13 9 12 10 11 EN IN2 D1 CCP V+ OUT2 OUT2 D2 PGND PGND Tab Figure 3. 33887 Pin Connections Table 1. 33887 HSOP PIN DEFINITIONS A functional description of each pin can be found in the Functional Pin DescriptionS section, page 21.
29 30 31 32 33 1 28 2 27 3 26 4 25 5 24 6 23 7 22 18 17 NC D2 PGND PGND PGND PGND PGND PGND FB NC IN1 V+ V+ OUT1 OUT1 NC OUT1 OUT1 16 19 15 10 14 20 13 21 9 11 8 12 NC D1 IN2 EN V+ V+ NC AGND FS NC 34 36 Transparent Top View of Package 35 CCP V+ V+ OUT2 OUT2 NC OUT2 OUT2 PIN CONNECTIONS Figure 4. 33887 Pin Connections Table 2. PQFN PIN DEFINITIONS A functional description of each pin can be found in the Functional Pin DescriptionS section, page 21.
PIN CONNECTIONS Transparent Top View of Package PGND PGND PGND PGND NC NC NC D2 NC OUT2 OUT2 OUT2 OUT2 NC V+ V+ V+ V+ NC NC NC NC CCP D1 IN2 EN NC 1 54 2 53 3 52 4 51 5 50 6 49 7 48 8 47 9 46 10 45 11 44 12 43 13 42 14 41 15 40 16 39 17 38 18 37 19 36 20 .35 21 34 22 33 23 32 24 31 25 30 26 29 27 28 PGND PGND PGND PGND NC NC NC FB NC OUT1 OUT1 OUT1 OUT1 NC V+ V+ V+ V+ NC NC NC NC IN1 FS AGND NC NC Figure 5. 33887 Pin Connections Table 3.
PIN CONNECTIONS Table 3. SOICW-EP PIN DEFINITIONS A functional description of each pin can be found in the Functional Pin DescriptionS section, page 21. Pin Pin Name Formal Name Definition 42 – 45 OUT1 H-Bridge Output 1 47 FB Feedback for H-Bridge Current feedback output providing ground referenced 1/375th ratio of H-Bridge high-side current. Pad Thermal Interface Exposed Pad Thermal Interface Exposed pad thermal interface for sinking heat from the device.
ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit V+ -0.3 to 40 V ELECTRICAL RATINGS Supply Voltage (1) Input Voltage (2) VIN - 0.3 to 7.0 V FS Status Output (3) V FS -0.3 to 7.0 V Continuous Current (4) IOUT 5.
ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS MAXIMUM RATINGS (continued) All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS (9), (10), (11), (12) Junction-to-Board (Bottom Exposed Pad Soldered to Board) HSOP (6.0 W) PQFN (4.0 W) SOICW-EP (2.0 W) Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) (13) ~7.0 ~8.0 ~9.0 (14) ~ 41 ~ 50 ~ 62 HSOP (6.0 W) PQFN (4.0 W) SOICW-EP (2.
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. STATIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 5.0 V ≤ V+ ≤ 28 V and -40°C ≤ TA ≤ 125°C unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max Unit V+ 5.
ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 4. STATIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 5.0 V ≤ V+ ≤ 28 V and -40°C ≤ TA ≤ 125°C unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted. Characteristic Symbol Min Typ Max 5.0 V ≤ V+ ≤ 28 V, TJ = 25°C – 120 – 8.0 V ≤ V+ ≤ 28 V, TJ = 150°C – – 225 5.0 V ≤ V+ ≤ 8.
ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 5. DYNAMIC ELECTRICAL CHARACTERISTICS Characteristics noted under conditions 5.0 V ≤ V+ ≤ 28 V and -40°C ≤ TA ≤ 125°C unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions unless otherwise noted.
ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS TIMING DIAGRAMS 5. 0 50% 0 50% t D(OFF) t D(ON) VPWR 90% 10% 0 TIME Figure 6. Output Delay Time 5.0 V 0V ℘?ℜ 0Ω Figure 7. Disable Delay Time VPWR tF tR 90% 90% 10% 10% 0 OUTPUT IIMAX CURRENT , CURRENT (A) (A) LIM,ILIM Figure 8. Output Switching Time 6.5 6.6 Operation within this region must be limited to nonrepetitive events not to exceed 30 seconds 4.0 2.5 Thermal Shutdown 150 160 175 T J, JUNCTION TEMPERATURE (o C) Figure 9.
SF, LOGIC OUT D2, LOGIC IN D1, LOGIC IN INn, LOGIC IN ILOAD, OUTPUT CURRENT (A) ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS >8A Short Circuit Detection Threshold Typical Current Limit Threshold 6.
ELECTRICAL CHARACTERISTICS TYPICAL SWITCHING WAVEFORMS TYPICAL SWITCHING WAVEFORMS • LLOAD = 533 μH @ 1.0 kHz • LLOAD = 530 μH @ 10.0 kHz • RLOAD = 4.0 Ω Important For all plots, the following applies: • Ch2 = 2.0 A per division Output Voltage (OUT1) IOUT Input Voltage (IN1) V+=24 V fPWM =1.0 kHz Duty Cycle=10% Figure 12. Output Voltage and Current vs. Input Voltage at V+ = 24 V, PMW Frequency of 1.0 kHz, and Duty Cycle of 10% Output Voltage (OUT1) IOUT Input Voltage (IN1) V+=24 V fPWM = 1.
ELECTRICAL CHARACTERISTICS TYPICAL SWITCHING WAVEFORMS Output Voltage (OUT1) IOUT Input Voltage (IN1) V+=34 V fPWM =1.0 kHz Duty Cycle=90% Figure 14. Output Voltage and Current vs. Input Voltage at V+ = 34 V, PMW Frequency of 1.0 kHz, and Duty Cycle of 90%, Showing Device in Current Limiting Mode Output Voltage (OUT1) IOUT Input Voltage (IN1) V+=22 V fPWM =1.0 kHz Duty Cycle=90% Figure 15. Output Voltage and Current vs. Input Voltage at V+ = 22 V, PMW Frequency of 1.
ELECTRICAL CHARACTERISTICS TYPICAL SWITCHING WAVEFORMS Output Voltage (OUT1) IOUT Input Voltage (IN1) V+=24 V fPWM =10 kHz Duty Cycle=50% Figure 16. Output Voltage and Current vs. Input Voltage at V+ = 24 V, PMW Frequency of 10 kHz, and Duty Cycle of 50% Output Voltage (OUT1) IOUT Input Voltage (IN1) V+=24 V fPWM =10 kHz Duty Cycle=90% Figure 17. Output Voltage and Current vs.
ELECTRICAL CHARACTERISTICS TYPICAL SWITCHING WAVEFORMS Output Voltage (OUT1) IOUT Input Voltage (IN1) V+=12 V fPWM =20 kHz Duty Cycle=50% Figure 18. Output Voltage and Current vs. Input Voltage at V+ = 12 V, PMW Frequency of 20 kHz, and Duty Cycle of 50% for a Purely Resistive Load Output Voltage (OUT1) IOUT Input Voltage (IN1) V+=12 V fPWM =20 kHz Duty Cycle=90% Figure 19. Output Voltage and Current vs.
ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES ELECTRICAL PERFORMANCE CURVES 2KPV 9ROWV Figure 20. Typical High-Side RDS(ON) Versus V+ 2KPV 2+06 9ROWV 93:5 Figure 21.
ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES 2+06 0LOOLDPSHUHV 9ROWV 93:5 Figure 22.
ELECTRICAL CHARACTERISTICS ELECTRICAL PERFORMANCE CURVES Table 6. Truth Table The tri-state conditions and the fault status are reset using D1 or D2. The truth table uses the following notations: L = LOW, H = HIGH, X = HIGH or LOW, and Z = High impedance (all output power transistors are switched off).
FUNCTIONAL DESCRIPTION INTRODUCTION FUNCTIONAL DESCRIPTION INTRODUCTION Numerous protection and operational features (speed, torque, direction, dynamic braking, PWM control, and closedloop control), in addition to the 5.0 A current capability, make the 33887 a very attractive, cost-effective solution for controlling a broad range of small DC motors. In addition, a pair of 33887 devices can be used to control bipolar stepper motors.
FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTIONS voltage with its analog-to-digital converter (ADC). This is intended to provide the user with motor current feedback for motor torque control. The resistance range for the linear operation of the FB pin is 100 < RFB < 200 Ω. If PWM-ing is implemented using the disable pin inputs (either D1 or D2), a small filter capacitor (1.0 μF or less) may be required in parallel with the external resistor to ground for fast spike suppression.
FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES The 33887 Simplified Internal Block Diagram shown in Figure 2, page 2, is a fully protected monolithic H-Bridge with Enable, Fault Status reporting, and High-Side current sense feedback to accommodate closed-loop PWM control.
FUNCTIONAL DEVICE OPERATION PROTECTION AND DIAGNOSTIC FEATURES PROTECTION AND DIAGNOSTIC FEATURES SHORT CIRCUIT PROTECTION If an output short circuit condition is detected, the power outputs tri-state (latch-OFF) independent of the input (IN1 and IN2) states, and the fault status output flag is SET logic LOW.
TYPICAL APPLICATIONS TYPICAL APPLICATIONS Figure 23 shows a typical application schematic. For precision high-current applications in harsh, noisy environments, the V+ by-pass capacitor may need to be substantially larger. DC MOTOR V+ 33887 AGND V+ CCP OUT1 FB + 1.0 μF 33 nF + 47 μF OUT2 EN D2 D1 100 Ω FS PGND IN1 IN2 FB IN2 IN1 FS D1 D2 EN Figure 23.
PACKAGING SOLDERING INFORMATION PACKAGING SOLDERING INFORMATION The 33887 packages are designed for thermal performance. The significant feature of these packages is the exposed pad on which the power die is soldered. When soldered to a PCB, this pad provides a path for heat flow to the ambient environment. The more copper area and thickness on the PCB, the better the power dissipation and transient behavior will be. Example Characterization on a double-sided PCB: bottom side area of copper is 7.
PACKAGING PACKAGING DIMENSIONS PACKAGING DIMENSIONS Important For the most current revision of the package, visit www.freescale.
PACKAGING PACKAGING DIMENSIONS VW SUFFIX 20-PIN HSOP 98ASH70702A ISSUE B 33887 28 Analog Integrated Circuit Device Data Freescale Semiconductor
PACKAGING PACKAGING DIMENSIONS FK (Pb-FREE) SUFFIX 36-PIN PQFN 98ASA10583D ISSUE C 33887 Analog Integrated Circuit Device Data Freescale Semiconductor 29
PACKAGING PACKAGING DIMENSIONS FK (Pb-FREE) SUFFIX 36-PIN PQFN 98ASA10583D ISSUE C 33887 30 Analog Integrated Circuit Device Data Freescale Semiconductor
PACKAGING PACKAGING DIMENSIONS EK SUFFIX (PB-FREE) 54-PIN SOICW EXPOSED PAD 98ASA10506D ISSUE C 33887 Analog Integrated Circuit Device Data Freescale Semiconductor 31
PACKAGING PACKAGING DIMENSIONS EK SUFFIX (PB-FREE) 54-PIN SOICW EXPOSED PAD 98ASA10506D ISSUE C 33887 32 Analog Integrated Circuit Device Data Freescale Semiconductor
ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) ADDITIONAL DOCUMENTATION 33887HSOP THERMAL ADDENDUM (REV 2.0) Introduction This thermal addendum is provided as a supplement to the MC33887 technical data sheet. The addendum provides thermal performance information that may be critical in the design and development of system applications. All electrical, application, and packaging information is provided in the data sheet.
ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) A Tab AGND FS IN1 V+ V+ OUT1 OUT1 FB PGND PGND 1 20 2 19 3 4 18 17 5 16 6 7 15 14 8 13 9 12 10 11 EN IN2 D1 CCP V+ OUT2 OUT2 D2 PGND PGND Tab 33887 Pin Connections 20-Pin HSOP-EP 1.27 mm Pitch 16.0 mm x 11.0 mm Body 12.2 mm x 6.9 mm Exposed Pad Figure 26. Thermal Test Board Device on Thermal Test Board Material: Outline: Area A: Ambient Conditions: Single layer printed circuit board FR4, 1.6 mm thickness Cu traces, 0.
ADDITIONAL DOCUMENTATION THERMAL ADDENDUM (REV 2.0) Thermal Resistance [ºC/W] 60 50 40 30 20 x RθJA 10 0 0 300 Heat spreading area A [mm²] 600 Figure 27. Device on Thermal Test Board RθJA Thermal Resistance [ºC/W] 100 10 1 0.1 1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04 Time[s] Figure 28.
REVISION HISTORY REVISION HISTORY REVISION DATE DESCRIPTION • Added Thermal Addendum & Converted to Freescale format, Revised PQFN drawing, made several minor spelling correction.
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