Datasheet

Analog Integrated Circuit Device Data
15 Freescale Semiconductor
MC34708
General Product Characteristics
5.2 Thermal Characteristics
V
ESD
ESD Ratings
Human Body Model All pins
Charge Device Model All pins
Air Gap Discharge Model for UID, VBUS, DP, and DM pins
Human Body Model (HBM) for UID, VBUS, DP, and DM pins
2000
500
15000
8000
V
(3)
(3)
(4)
(4)
Notes
3. ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500 ), and the Charge Device
Model (CDM), Robotic (C
ZAP
= 4.0 pF).
4. Need external ESD protection diode array to meet IEC1000-4-2 15000 V Air Gap discharge and 8000 V HBM requirements.
(CZAP
= 150 pF, RZAP = 330 ohm).
Table 5. Thermal Ratings
Symbol Description (Rating) Min. Max. Unit Notes
THERMAL RATINGS
T
A
Ambient Operating Temperature Range -40
85
°C
T
J
Operating Junction Temperature Range
-40
125
°C
(5)
T
ST
Storage Temperature Range -65
150
°C
T
PPRT
Peak Package Reflow Temperature During Reflow -
Note 7
°C
(6),
(7)
8.0 X 8.0 MM, THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
R
θJA
Junction to Ambient Natural Convection
Single layer board (1s)
- 93
°C/W
(8),
(9)
R
θJMA
Junction to Ambient Natural Convection
Four layer board (2s2p)
-
53
°C/W
(8),
(10)
R
θJMA
Junction to Ambient (@200 ft/min.)
Single layer board (1s)
-
80
°C/W
(8),
(10)
R
θJMA
Junction to Ambient (@200 ft/min.)
Four layer board (2s2p)
-
49
°C/W
(8),
(10)
R
θJB
Junction to Board
-
34
°C/W
(11)
R
θJC
Junction to Case
-
25
°C/W
(12)
θJT
Junction to Package Top
Natural Convection
-
3.0
°C/W
(13)
13 X 13 MM, THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
R
θJA
Junction to Ambient Natural Convection
Single layer board (1s)
-
57 °C/W
(8), (9)
R
θJMA
Junction to Ambient Natural Convection
Four layer board (2s2p)
-
36 °C/W
(8), (9),
(10)
Table 4. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol Description (Rating) Max. Unit Notes