Datasheet
Analog Integrated Circuit Device Data
15 Freescale Semiconductor
MC34708
General Product Characteristics
5.2 Thermal Characteristics
V
ESD
ESD Ratings
• Human Body Model All pins
• Charge Device Model All pins
• Air Gap Discharge Model for UID, VBUS, DP, and DM pins
• Human Body Model (HBM) for UID, VBUS, DP, and DM pins
2000
500
15000
8000
V
(3)
(3)
(4)
(4)
Notes
3. ESD testing is performed in accordance with the Human Body Model (HBM) (C
ZAP
= 100 pF, R
ZAP
= 1500 ), and the Charge Device
Model (CDM), Robotic (C
ZAP
= 4.0 pF).
4. Need external ESD protection diode array to meet IEC1000-4-2 15000 V Air Gap discharge and 8000 V HBM requirements.
(CZAP
= 150 pF, RZAP = 330 ohm).
Table 5. Thermal Ratings
Symbol Description (Rating) Min. Max. Unit Notes
THERMAL RATINGS
T
A
Ambient Operating Temperature Range -40
85
°C
T
J
Operating Junction Temperature Range
-40
125
°C
(5)
T
ST
Storage Temperature Range -65
150
°C
T
PPRT
Peak Package Reflow Temperature During Reflow -
Note 7
°C
(6),
(7)
8.0 X 8.0 MM, THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
R
θJA
Junction to Ambient Natural Convection
• Single layer board (1s)
- 93
°C/W
(8),
(9)
R
θJMA
Junction to Ambient Natural Convection
• Four layer board (2s2p)
-
53
°C/W
(8),
(10)
R
θJMA
Junction to Ambient (@200 ft/min.)
• Single layer board (1s)
-
80
°C/W
(8),
(10)
R
θJMA
Junction to Ambient (@200 ft/min.)
• Four layer board (2s2p)
-
49
°C/W
(8),
(10)
R
θJB
Junction to Board
-
34
°C/W
(11)
R
θJC
Junction to Case
-
25
°C/W
(12)
θJT
Junction to Package Top
• Natural Convection
-
3.0
°C/W
(13)
13 X 13 MM, THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
R
θJA
Junction to Ambient Natural Convection
• Single layer board (1s)
-
57 °C/W
(8), (9)
R
θJMA
Junction to Ambient Natural Convection
• Four layer board (2s2p)
-
36 °C/W
(8), (9),
(10)
Table 4. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol Description (Rating) Max. Unit Notes
