Datasheet

MC56F8006/MC56F8002 Digital Signal Controller, Rev. 4
Specifications
Freescale Semiconductor44
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
R
JMA
42 °C/W
Junction to board R
JB
23 °C/W
Junction to case R
JC
26 °C/W
Junction to package top Natural Convection 
JT
9°C/W
Table 16. 32LQFP Package Thermal Characteristics
Characteristic Comments Symbol
Value
(LQFP)
Unit
Junction to ambient
Natural convection
Single layer board
(1s)
R
JA
84 °C/W
Junction to ambient
Natural convection
Four layer board
(2s2p)
R
JMA
56 °C/W
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
R
JMA
70 °C/W
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
R
JMA
49 °C/W
Junction to board R
JB
33 °C/W
Junction to case R
JC
20 °C/W
Junction to package top Natural convection 
JT
4°C/W
Table 17. 32PSDIP Package Thermal Characteristics
Characteristic Comments Symbol
Value
(LQFP)
Unit
Junction to ambient
Natural convection
Single layer board
(1s)
R
JA
56 °C/W
Junction to ambient
Natural convection
Four layer board
(2s2p)
R
JMA
41 °C/W
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
R
JMA
45 °C/W
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
R
JMA
36 °C/W
Junction to board R
JB
18 °C/W
Junction to case R
JC
24 °C/W
Junction to package top Natural convection 
JT
10 °C/W
Table 15. 28SOIC Package Thermal Characteristics (continued)
Characteristic Comments Symbol
Value
(LQFP)
Unit