Datasheet

General Characteristics
56F8014 Technical Data, Rev. 11
Freescale Semiconductor 93
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC analog inputs
10.1.1 ElectroStatic Discharge (ESD) Model
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESC51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
1. Pin Group 3 can tolerate 6V for less than 5 seconds when they are configured as ADC inputs or during reset. Pin Group 3 can
tolerate 6V if they are configured as GPIO.
2. Continuous input current per pin is -2 mA
Table 10-2 56F8014 ESD Protection
Characteristic Min Typ Max Unit
ESD for Human Body Model (HBM) 2000 — — V
ESD for Machine Model (MM) 200 — — V
ESD for Charge Device Model (CDM) 750 — — V
Table 10-3 LQFP Package Thermal Characteristics
6
Characteristic
Comments
Symbol
Value
(LQFP)
Unit Notes
Junction to ambient
Natural convection
Single layer board
(1s)
R
θJA
74 °C/W 1,2
Junction to ambient
Natural convection
Four layer board
(2s2p)
R
θJMA
50 °C/W 1,3
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
R
θJMA
67 °C/W 1,3
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
R
θJMA
46 °C/W 1,3
Junction to board R
θJB
23 °C/W 4
Junction to case R
θJC
20 °C/W 5
Junction to package top Natural Convection Ψ
JT
4°C/W6