Datasheet

56F8014 Technical Data, Rev. 11
94 Freescale Semiconductor
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per
JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
7. See Section 12.1 for more details on thermal design considerations.