Datasheet

General Characteristics
56F8014 Technical Data, Rev. 11
Freescale Semiconductor 95
Note: Total chip source or sink current cannot exceed 50mA
Default Mode
Pin Group 1: GPIO, TDI, TDO, TMS, TCK
Pin Group 2: RESET, GPIOA7
Pin Group 3: ADC analog inputs
Table 10-4 Recommended Operating Conditions
(V
REFL
= 0V, V
SSA
= 0V, V
SS
= 0V )
Characteristic Symbol Notes Min Typ Max Unit
Supply voltage
V
DD
33.3 3.6 V
ADC Supply voltage
V
DDA
33.3 3.6 V
ADC High Voltage Reference
V
REFH
3—V
DDA
V
Voltage difference V
DD_IO
to V
DDA
ΔV
DD
-0.1 0 0.1 V
Voltage difference V
SS_IO
to V
SSA
ΔV
SS
-0.1 0 0.1 V
Device Clock Frequency
Using relaxation oscillator
Using external clock source
FSYSCLK
8
0
—
32
32
MHz
Input Voltage High (digital inputs)
V
IH
Pin Groups 1, 2 2 — 5.5 V
Input Voltage Low (digital inputs)
V
IL
Pin Groups 1, 2 -0.3 — 0.8 V
Output Source Current High (at V
OH
min.)
When programmed for low drive strength
When programmed for high drive strength
I
OH
Pin Group 1
Pin Group 1
—
—
—
—
-4
-8
mA
Output Source Current Low (at V
OL
max.)
When programmed for low drive strength
When programmed for high drive strength
I
OL
Pin Groups 1, 2
Pin Groups 1, 2
—
—
—
—
4
8
mA
Ambient Operating Temperature
(Automotive)
T
A
-40 —
125 °C
Ambient Operating Temperature (Industrial)
T
A
-40 —
105 °C
Flash Endurance (Automotive)
(Program Erase Cycles)
N
F
T
A
= -40°C to
125°C
10,000 — —
Cycles
Flash Endurance (Industrial)
(Program Erase Cycles)
N
F
T
A
= -40°C to
105°C
10,000 — —
Cycles
Flash Data Retention
T
R
T
J
<= 85°C avg 15 — — Years
Flash Data Retention with <100
Program/Erase Cycles
t
FLRET
T
J
<= 85°C avg 20 — — Years