Datasheet

56F8346 Technical Data, Rev. 15
140 Freescale Semiconductor
Preliminary
Total chip source or sink current cannot exceed 200mA
See Pin Groups in Table 10-1
Internal Logic Core Supply Voltage
V
DD_CORE
OCR_DIS is High
2.25 2.5 2.75
V
Device Clock Frequency
FSYSCLK
0— 60
MHz
Input High Voltage (digital)
V
IN
Pin Groups
1, 2, 5, 6, 9, 10
2—5.5
V
Input High Voltage (analog)
V
IHA
Pin Group 13
2—V
DDA
+0.3
V
Input High Voltage (XTAL/EXTAL,
XTAL is not driven by an external clock)
V
IHC
Pin Group 11
V
DDA
-0.8 — V
DDA
+0.3
V
Input high voltage (XTAL/EXTAL,
XTAL is driven by an external clock)
V
IHC
Pin Group 11
2—V
DDA
+0.3
V
Input Low Voltage
V
IL
Pin Groups
1, 2, 5, 6, 9, 10,
11, 13
-0.3 — 0.8
V
Output High Source Current
V
OH
= 2.4V (V
OH
min.)
I
OH
Pin Groups 1, 2, 3
—— -4
mA
Pin Groups 5, 6, 7
—— -8
Pin Group 8
—— -12
Output Low Sink Current
V
OL
= 0.4V (V
OL
max)
I
OL
Pin Groups
1, 2, 3, 4
—— 4
mA
Pin Groups 5, 6, 7
—— 8
Pin Group 8
—— 12
Ambient Operating Temperature
(Automotive)
T
A
-40 —
125 °C
Ambient Operating Temperature
(Industrial)
T
A
-40 —
105 °C
Flash Endurance (Automotive)
(Program Erase Cycles)
N
F
T
A
= -40°C to 125°C
10,000 — —
Cycles
Flash Endurance (Industrial)
(Program Erase Cycles)
N
F
T
A
= -40°C to 105°C
10,000 — —
Cycles
Flash Data Retention
T
R
T
J
<= 85°C avg
15 — —
Years
Table 10-4 Recommended Operating Conditions
(V
REFLO
= 0V, V
SS
= V
SSA_ADC
= 0V
,
V
DDA
= V
DDA_ADC
= V
DDA_OSC_PLL
)
Characteristic Symbol Notes Min Typ Max Unit