Datasheet

56F8146 Package and Pin-Out Information
56F8346 Technical Data, Rev. 15
Freescale Semiconductor 173
Preliminary
Figure 11-3 144-pin LQFP Mechanical Information
D0.20 H B-C
144
GAGE PLANE
73
109
37
SEATING
108
1
36
72
PLANE
4X 4X 36 TIPS
PIN 1
INDEX
VIEW A
E1
E1/2
E/2
D1/2
D/2
E
e/2
e
D1
D
0.1
A
2θ
VIEW B
A
A
140X
4X
VIEW A
PLATING
b1
c1
c
b
BASE
METAL
SECTION A-A
(ROTATED 90 )
144 PLACES
°
D0.08
M
AB-C
θ
DIM
D1
MIN MAX
20.00 BSC
MILLIMETERS
E1 20.00 BSC
A --- 1.60
A1 0.05 0.15
A2 1.35 1.45
b 0.17 0.27
L 0.45 0.75
b1 0.17 0.23
e 0.50 BSC
c 0.09 0.20
L2 0.50 REF
R1 0.13 0.20
R2 0.13 ---
D 22.00 BSC
E 22.00 BSC
S 0.25 REF
L1 1.00 REF
c1 0.09 0.16
θ 0 7
θ 0 ---
θ
1
2
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
3. DATUMS B, C AND D TO BE DETERMINED AT DATUM
H.
4. THE TOP PACKAGE BODY SIZE MAY BE SMALLER
THAN THE BOTTOM PACKAGE SIZE BY A MAXIMUM
OF 0.1 mm.
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSIONS. THE MAXIMUM ALLOWABLE
PROTRUSION IS 0.25 mm PER SIDE. D1 AND E1 ARE
MAXIMUM BODY SIZE DIMENSIONS INCLUDING MOLD
MISMATCH.
6. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. PROTRUSIONS SHALL NOT CAUSE
THE LEAD WIDTH TO EXCEED 0.35. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD
SHALL BE 0.07 mm.
7. DIMENSIONS D AND E TO BE DETERMINED AT THE
SEATING PLANE, DATUM A.
°
°
°
°
0.05
C
L
L1
R2
L
A2
S
R1
L2
A1
1θ
0.25
VIEW B
D
0.20 A B-C
C
B
D
A
A
144X
X
X=B, C or D
8X
12 REF
4
TOP VIEW
5
7
4 5
7
SIDE VIEW
H
6
3