Datasheet

56F8357 Package and Pin-Out Information
56F8357 Technical Data, Rev. 15
Freescale Semiconductor 159
Preliminary
Part 11 Packaging
Note: The 160 Map Ball Grid Array is not available in the 56F8157 device.
11.1 56F8357 Package and Pin-Out Information
This section contains package and pin-out information for the 56F8357. This device comes in a 160-pin
Low-profile Quad Flat Pack (LQFP) and 160 Map Ball Grid Array. Figure 11-1 shows the package
lay-out for the 160-pin LQFP, and Figure 11-2 for the160 Map Ball Grid Array. Figure 11-5 shows the
mechanical parameters for the LQFP package and Figure 11-3 for the MBGA, Table 11-1 lists the pin-out
for the 160-pin LQFP and Table 11-2 lists the pin-out for the 160 MBGA.
Figure 11-1 Top View, 56F8357 160-Pin LQFP Package
V
DD_IO
V
PP
2
CLKO
TXD0
RXD0
PHASEA1
PHASEB1
INDEX1
HOME1
A1
A2
A3
A4
A5
V
CAP
4
V
DD_IO
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
V
SS
D7
D8
D9
V
DD_IO
D10
GPIOB0
GPIOB1
GPIOB2
GPIOB3
Pin 1
Orientation Mark
121
41
GPIOB4
PWMB0
PWMB1
PWMB2
V
SS
EMI_MODE
HOME0
INDEX0
PHASEB0
PHASEA0
A0
D15
D14
D13
D12
D11
MOSI0
MISO0 SCLK0
SS0
V
CAP
2
CAN_RX
CAN_TX
V
PP
1
TDO
TDI
TMS
TCK
TRST
TC1
V
DD_IO
TC0
TD3
TD2
TD1
TD0 ISA2
ISA1 ISA0 V
SS
EXTBOOT
ANB7
ANB6 ANB5
V
SS
V
DD_IO
PWMB3
PWMB4
PWMB5
GPIOB5
GPIOB6
GPIOB7
TXD1
RXD1
WR
RD
PS
DS
GPIOD0
GPIOD1 GPIOD2
GPIOD3
GPIOD4
GPIOD5
ISB0
V
CAP
1
ISB1
ISB2
IRQA
IRQB
FAULTB0 FAULTB1
FAULTB2
D0
D1
FAULTB3
PWMA0
V
SS
PWMA1 PWMA2
V
DD_IO
PWMA3
PWMA4
V
SS
ANB4
ANB3
ANB2
ANB1
ANB0
V
SSA_ADC
V
DDA_ADC
V
REFH
V
REFP
V
REFMID
V
REFN
V
REFLO
TEMP_SENSE
ANA7
ANA6
ANA5
ANA4
ANA3
ANA2
ANA1
ANA0
CLKMODE
RESET
RSTO
V
DD_IO
V
CAP
3
EXTAL
XTAL
VDDA_OSC_PLL
OCR_DIS
D6
D5
D4
FAULTA3
D3
FAULTA2
FAULTA1
D2
FAULTA0
PWMA5
81