Datasheet

Power Distribution and I/O Ring Implementation
56F8357 Technical Data, Rev. 15
Freescale Semiconductor 173
Preliminary
Part 13 Ordering Information
Table 13-1 lists the pertinent information needed to place an order. Consult a Freescale Semiconductor
sales office or authorized distributor to determine availability and to order parts.
*This package is RoHS compliant.
Table 13-1 Ordering Information
Part
Supply
Voltage
Package Type
Pin
Count
Frequency
(MHz)
Ambient
Temperature
Range
Order Number
MC56F8357 3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160 60 -40° to + 105° C MC56F8357VPY60
MC56F8157 3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160 60 -40° to + 105° C MC56F8157VPY
MC56F8357 3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160 60 -40° to + 105° C MC56F8357VPYE*
MC56F8357 3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160 60 -40° to + 125° C MC56F8357MPYE*
MC56F8157 3.0–3.6 V
Low-Profile Quad Flat Pack (LQFP)
160 60 -40° to + 105° C MC56F8157VPYE*
MC56F8357 3.0–3.6 V
Mold Array Process Ball Grid Array
(MAPBGA)
160 60 -40° to + 105° C MC56F8357VVF*