Datasheet

56F8165 Package and Pin-Out Information
56F8365 Technical Data, Rev. 9
Freescale Semiconductor 173
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE H IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4. DATUMS A, B, AND D TO BE DETERMINED AT DATUM
PLANE H.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE C.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 PER
SIDE. DIMENSIONS D1 AND E1 DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT DATUM
PLANE H.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE b DIMENSION TO EXCEED 0.35.
DIM
MILLIMETERS
MIN MAX
A --- 1.60
A1 0.05 0.15
A2 1.35 1.45
b 0.17 0.27
b1 0.17 0.23
c 0.09 0.20
c1 0.09 0.16
D 22.00 BSC
D1 20.00BSC
e 0.50 BSC
E 16.00 BSC
E1 14.00 BSC
L 0.45 0.75
L1 1.00 REF
L2 0.50 REF
S 0.20 ---
R1 0.08 ---
R2 0.08 0.20
0
0
o
7
o
01
0
o
---
02
11
o
13
o