Datasheet
Table Of Contents
- 1 Overview
- 2 Features
- 3 Comparison with the MPC7447, MPC7445, and MPC7441
- 4 General Parameters
- 5 Electrical and Thermal Characteristics
- 6 Pin Assignments
- 7 Pinout Listings
- 8 Package Description
- 8.1 Package Parameters for the MPC7447A, 360 HCTE BGA
- 8.2 Mechanical Dimensions for the MPC7447A, 360 HCTE BGA
- 8.3 Package Parameters for the MPC7447A, 360 HCTE LGA
- 8.4 Mechanical Dimensions for the MPC7447A, 360 HCTE LGA
- 8.5 Package Parameters for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.6 Mechanical Dimensions for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.7 Substrate Capacitors for the MPC7447A, 360 HCTE
- 9 System Design Information
- 9.1 Clocks
- 9.2 PLL Power Supply Filtering
- 9.3 Decoupling Recommendations
- 9.4 Connection Recommendations
- 9.5 Output Buffer DC Impedance
- 9.6 Pull-Up/Pull-Down Resistor Requirements
- 9.7 JTAG Configuration Signals
- 9.8 Thermal Management Information
- Figure 20. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- Figure 21. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- 9.8.1 Internal Package Conduction Resistance
- 9.8.2 Thermal Interface Materials
- 9.8.3 Heat Sink Selection Example
- 9.8.4 Temperature Diode
- 9.8.5 Dynamic Frequency Switching (DFS)
- 10 Document Revision History
- 11 Ordering Information
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
16 Freescale Semiconductor
Electrical and Thermal Characteristics
5.2.2 Processor Bus AC Specifications
Table 9 provides the processor bus AC timing specifications for the MPC7447A as defined in Figure 4 and
Figure 5.
Table 9. Processor Bus AC Timing Specifications
1
At recommended operating conditions. See Table 4.
Parameter Symbol
2
All Speed Grades
Unit Notes
Min Max
Input setup times:
A[0:35], AP[0:4]
D[0:63], DP[0:7]
AACK
, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3], GBL,
TT[0:3], QACK
, TA, TBEN, TEA, TS, EXT_QUAL,
PMON_IN
, SHD[0:1]
BMODE
[0:1], BVSEL
t
AVKH
t
DVKH
t
IVKH
t
MVKH
1.8
1.8
1.8
1.8
—
—
—
—
ns
—
—
—
8
Input hold times:
A[0:35], AP[0:4]
D[0:63], DP[0:7]
AACK
, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3], GBL,
TT[0:3], QACK
, TA, TBEN, TEA, TS, EXT_QUAL,
PMON_IN
, SHD[0:1]
BMODE
[0:1], BVSEL
t
AXKH
t
DXKH
t
IXKH
t
MXKH
0
0
0
0
—
—
—
—
ns
—
—
—
—
8
Output valid times:
A[0:35], AP[0:4]
D[0:63], DP[0:7]
AACK
, BR, CI, CKSTP_IN, DRDY, DTI[0:3], GBL, HIT,
PMON_OUT
, QREQ, TBST, TSIZ[0:2], TT[0:3], WT
TS
ARTRY, SHD[0:1]
t
KHAV
t
KHDV
t
KHOV
t
KHTSV
t
KHARV
—
—
—
—
—
2.0
2.0
2.0
2.0
2.0
ns
Output hold times:
A[0:35], AP[0:4]
D[0:63], DP[0:7]
AACK
, BR, CI, CKSTP_IN, DRDY, DTI[0:3], GBL, HIT,
PMON_OUT
, QREQ, TBST, TSIZ[0:2], TT[0:3], WT
TS
ARTRY, SHD[0:1]
t
KHAX
t
KHDX
t
KHOX
t
KHTSX
t
KHARX
0.5
0.5
0.5
0.5
0.5
—
—
—
—
—
ns
SYSCLK to output enable t
KHOE
0.5 — ns 5
SYSCLK to output high impedance (all except TS
, ARTRY,
SHD0
, SHD1)
t
KHOZ
—3.5ns5
SYSCLK to TS
high impedance after precharge t
KHTSPZ
—1t
SYSCLK
3, 4, 5
Maximum delay to ARTRY
/SHD0/SHD1 precharge t
KHARP
—1t
SYSCLK
3, 5, 6, 7
