Datasheet
Table Of Contents
- 1 Overview
- 2 Features
- 3 Comparison with the MPC7447, MPC7445, and MPC7441
- 4 General Parameters
- 5 Electrical and Thermal Characteristics
- 6 Pin Assignments
- 7 Pinout Listings
- 8 Package Description
- 8.1 Package Parameters for the MPC7447A, 360 HCTE BGA
- 8.2 Mechanical Dimensions for the MPC7447A, 360 HCTE BGA
- 8.3 Package Parameters for the MPC7447A, 360 HCTE LGA
- 8.4 Mechanical Dimensions for the MPC7447A, 360 HCTE LGA
- 8.5 Package Parameters for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.6 Mechanical Dimensions for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.7 Substrate Capacitors for the MPC7447A, 360 HCTE
- 9 System Design Information
- 9.1 Clocks
- 9.2 PLL Power Supply Filtering
- 9.3 Decoupling Recommendations
- 9.4 Connection Recommendations
- 9.5 Output Buffer DC Impedance
- 9.6 Pull-Up/Pull-Down Resistor Requirements
- 9.7 JTAG Configuration Signals
- 9.8 Thermal Management Information
- Figure 20. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- Figure 21. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- 9.8.1 Internal Package Conduction Resistance
- 9.8.2 Thermal Interface Materials
- 9.8.3 Heat Sink Selection Example
- 9.8.4 Temperature Diode
- 9.8.5 Dynamic Frequency Switching (DFS)
- 10 Document Revision History
- 11 Ordering Information
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor 19
Electrical and Thermal Characteristics
5.2.3 IEEE 1149.1 AC Timing Specifications
Table 10 provides the IEEE 1149.1 (JTAG) AC timing specifications as defined in Figure 16 through
Figure 19.
Figure 7
provides the AC test load for TDO and the boundary-scan outputs of the MPC7447A.
Figure 7. Alternate AC Test Load for the JTAG Interface
Table 10. JTAG AC Timing Specifications (Independent of SYSCLK)
1
At recommended operating conditions. See Table 4.
Parameter Symbol Min Max Unit Notes
TCK frequency of operation f
TCLK
0 33.3 MHz
TCK cycle time t
TCLK
30 — ns
TCK clock pulse width measured at 1.4 V t
JHJL
15 — ns
TCK rise and fall times t
JR
and t
JF
—2ns
TRST
assert time t
TRST
25 — ns 2
Input setup times:
Boundary-scan data
TMS, TDI
t
DVJH
t
IVJH
4
0
—
—
ns 3
Input hold times:
Boundary-scan data
TMS, TDI
t
DXJH
t
IXJH
20
25
—
—
ns 3
Valid times:
Boundary-scan data
TDO
t
JLDV
t
JLOV
4
4
20
25
ns 4
Output hold times:
Boundary-scan data
TDO
t
JLDX
t
JLOX
30
30
—
—
ns 4
TCK to output high impedance:
Boundary-scan data
TDO
t
JLDZ
t
JLOZ
3
3
19
9
ns 4, 5
Notes:
1. All outputs are measured from the midpoint voltage of the falling/rising edge of TCLK to the midpoint of the signal
in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load
(see Figure 7). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
2. TRST
is an asynchronous level sensitive signal. The time is for test purposes only.
3. Non-JTAG signal input timing with respect to TCK.
4. Non-JTAG signal output timing with respect to TCK.
5. Guaranteed by design and characterization.
Output
Z
0
= 50 Ω
OV
DD
/2
R
L
= 50 Ω
