Datasheet

MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor 27
Package Description
8 Package Description
The following sections provide the package parameters and mechanical dimensions for the HCTE
package.
8.1 Package Parameters for the MPC7447A, 360 HCTE BGA
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
high coefficient of thermal expansion ceramic ball grid array (HCTE).
Package outline 25 × 25 mm
Interconnects 360 (19 × 19 ball array – 1)
Pitch 1.27 mm (50 mil)
Minimum module height 2.72 mm
Maximum module height 3.24 mm
Ball diameter 0.89 mm (35 mil)
Coefficient of thermal expansion 12.3 ppm/°C