Datasheet

MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
28 Freescale Semiconductor
Package Description
8.2 Mechanical Dimensions for the MPC7447A, 360 HCTE BGA
Figure 13 provides the mechanical dimensions and bottom surface nomenclature for the MPC7447A, 360
HCTE BGA package.
Figure 13. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7447A,
360 HCTE BGA Package
NOTES:
1. Dimensioning and
tolerancing per ASME
Y14.5M, 1994
2. Dimensions in millimeters.
3. Top side A1 corner index is a
metalized feature with
various shapes. Bottom side
A1 corner is designated with
a ball missing from the array.
0.2
C
A
360X
D
2X
A1 CORNER
E
e
0.2
2X
C
B
12345678910111213141516
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
B0.3
A
0.15
b
A
0.15 A
171819
U
W
V
Millimeters
Dim Min Max
A 2.72 3.24
A1 0.80 1.00
A2 1.10 1.30
A3 — 0.6
b 0.82 0.93
D 25.00 BSC
D1 — 11.3
D2 8.0 —
D3 — 6.5
D4 9.76 9.96
e 1.27 BSC
E 25.00 BSC
E1 — 11.3
E2 8.0 —
E3 — 6.5
E4 8.41 8.61
Capacitor Region
1
D3
E2
E1
A
A1
A2
A3
E4
D4
E3
D1
D2
0.35 A