Datasheet
Table Of Contents
- 1 Overview
- 2 Features
- 3 Comparison with the MPC7447, MPC7445, and MPC7441
- 4 General Parameters
- 5 Electrical and Thermal Characteristics
- 6 Pin Assignments
- 7 Pinout Listings
- 8 Package Description
- 8.1 Package Parameters for the MPC7447A, 360 HCTE BGA
- 8.2 Mechanical Dimensions for the MPC7447A, 360 HCTE BGA
- 8.3 Package Parameters for the MPC7447A, 360 HCTE LGA
- 8.4 Mechanical Dimensions for the MPC7447A, 360 HCTE LGA
- 8.5 Package Parameters for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.6 Mechanical Dimensions for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.7 Substrate Capacitors for the MPC7447A, 360 HCTE
- 9 System Design Information
- 9.1 Clocks
- 9.2 PLL Power Supply Filtering
- 9.3 Decoupling Recommendations
- 9.4 Connection Recommendations
- 9.5 Output Buffer DC Impedance
- 9.6 Pull-Up/Pull-Down Resistor Requirements
- 9.7 JTAG Configuration Signals
- 9.8 Thermal Management Information
- Figure 20. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- Figure 21. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- 9.8.1 Internal Package Conduction Resistance
- 9.8.2 Thermal Interface Materials
- 9.8.3 Heat Sink Selection Example
- 9.8.4 Temperature Diode
- 9.8.5 Dynamic Frequency Switching (DFS)
- 10 Document Revision History
- 11 Ordering Information
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
Freescale Semiconductor 29
Package Description
8.3 Package Parameters for the MPC7447A, 360 HCTE LGA
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360 high
coefficient of thermal expansion ceramic land grid array (HCTE).
Package outline 25 × 25 mm
Interconnects 360 (19 × 19 ball array – 1)
Pitch 1.27 mm (50 mil)
Minimum module height 1.92 mm
Maximum module height 2.20 mm
Coefficient of thermal expansion 12.3 ppm/°C