Datasheet
Table Of Contents
- 1 Overview
- 2 Features
- 3 Comparison with the MPC7447, MPC7445, and MPC7441
- 4 General Parameters
- 5 Electrical and Thermal Characteristics
- 6 Pin Assignments
- 7 Pinout Listings
- 8 Package Description
- 8.1 Package Parameters for the MPC7447A, 360 HCTE BGA
- 8.2 Mechanical Dimensions for the MPC7447A, 360 HCTE BGA
- 8.3 Package Parameters for the MPC7447A, 360 HCTE LGA
- 8.4 Mechanical Dimensions for the MPC7447A, 360 HCTE LGA
- 8.5 Package Parameters for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.6 Mechanical Dimensions for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.7 Substrate Capacitors for the MPC7447A, 360 HCTE
- 9 System Design Information
- 9.1 Clocks
- 9.2 PLL Power Supply Filtering
- 9.3 Decoupling Recommendations
- 9.4 Connection Recommendations
- 9.5 Output Buffer DC Impedance
- 9.6 Pull-Up/Pull-Down Resistor Requirements
- 9.7 JTAG Configuration Signals
- 9.8 Thermal Management Information
- Figure 20. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- Figure 21. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- 9.8.1 Internal Package Conduction Resistance
- 9.8.2 Thermal Interface Materials
- 9.8.3 Heat Sink Selection Example
- 9.8.4 Temperature Diode
- 9.8.5 Dynamic Frequency Switching (DFS)
- 10 Document Revision History
- 11 Ordering Information
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
46 Freescale Semiconductor
System Design Information
the selection of any thermal interface material depends on many factors—thermal performance
requirements, manufacturability, service temperature, dielectric properties, cost, and so on.
Figure 23. Thermal Performance of Select Thermal Interface Material
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration
requirements. There are several commercially available thermal interfaces and adhesive materials
provided by the following vendors:
The Bergquist Company 800-347-4572
18930 West 78
th
St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc. 781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation 800-248-2481
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dowcorning.com
0
0.5
1
1.5
2
0 1020304050607080
Silicone Sheet (0.006 in.)
Bare Joint
Fluoroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific Thermal Resistance (K-in.
2
/W)