Datasheet
Table Of Contents
- 1 Overview
- 2 Features
- 3 Comparison with the MPC7447, MPC7445, and MPC7441
- 4 General Parameters
- 5 Electrical and Thermal Characteristics
- 6 Pin Assignments
- 7 Pinout Listings
- 8 Package Description
- 8.1 Package Parameters for the MPC7447A, 360 HCTE BGA
- 8.2 Mechanical Dimensions for the MPC7447A, 360 HCTE BGA
- 8.3 Package Parameters for the MPC7447A, 360 HCTE LGA
- 8.4 Mechanical Dimensions for the MPC7447A, 360 HCTE LGA
- 8.5 Package Parameters for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.6 Mechanical Dimensions for the MPC7447A, 360 HCTE RoHS-Compliant BGA
- 8.7 Substrate Capacitors for the MPC7447A, 360 HCTE
- 9 System Design Information
- 9.1 Clocks
- 9.2 PLL Power Supply Filtering
- 9.3 Decoupling Recommendations
- 9.4 Connection Recommendations
- 9.5 Output Buffer DC Impedance
- 9.6 Pull-Up/Pull-Down Resistor Requirements
- 9.7 JTAG Configuration Signals
- 9.8 Thermal Management Information
- Figure 20. BGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- Figure 21. LGA Package Exploded Cross-Sectional View with Several Heat Sink Options
- 9.8.1 Internal Package Conduction Resistance
- 9.8.2 Thermal Interface Materials
- 9.8.3 Heat Sink Selection Example
- 9.8.4 Temperature Diode
- 9.8.5 Dynamic Frequency Switching (DFS)
- 10 Document Revision History
- 11 Ordering Information
MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5
52 Freescale Semiconductor
Document Revision History
10 Document Revision History
Table 17 provides a revision history for this hardware specification.
11 Ordering Information
Ordering information for the parts fully covered by this specification document is provided in
Section 11.1, “Part Numbers Fully Addressed by This Document.” Note that the individual part numbers
correspond to a maximum processor core frequency. For available frequencies, contact a local Freescale
sales office. In addition to the processor frequency, the part numbering scheme also includes an application
modifier that may specify special application conditions. Each part number also contains a revision level
code that refers to the die mask revision number. Section 11.2, “Part Numbers Not Fully Addressed by This
Document,” lists the part numbers that do not fully conform to the specifications of this document. These
special part numbers require an additional document called a hardware specification addendum.
Table 17. Document Revision History
Revision
Number
Date Substantive Changes
5 01/30/2005
Corrected RoHS BGA sphere diameter dimensions
4 09/23/2005 Added RoHS BGA case outlines and part numbers.
Removed note references for CI
and WT in Table 12
3 08/23/2005 Added “Section 9.1.2, “System Bus Clock (SYSCLK) and Spread Spectrum Sources”
Section 9.8, “Thermal Management Information”: Added vendor to list
Section 9.8.3, “Heat Sink Selection Example”: Correct silicon die and underfil/bump model dimensions
2 02/16/2005 Changed die size
Table 8: Modified jitter specifications to conform to JEDEC standards, changed jitter specification to
cycle-to-cycle jitter (instead of long- and short-term jitter); changed jitter bandwidth recommendations.
Added information for LGA package.
1 — Added t
KHTSV
, t
KHARV
, t
KHTSX
, and t
KHARX
to Ta bl e 9 ; these were previously grouped with t
KHOV
and
t
KHOX
. NOTE: Documentation change only; the values for the output valid and output hold AC timing
specifications remain unchanged for TS
, ARTRY, and SHD[0:1].
Added derating section with table; added 1000 MHz speed bin
0.1 — Retitled Ta ble 1 9 to include document order information for MC7447AnnnnNx series hardware
specification addendum.
0 — Initial revision.