Datasheet

Electrical Specifications
MC68HC908GR16 Data Sheet, Rev. 5.0
260 Freescale Semiconductor
20.9 Clock Generation Module Characteristics
20.9.1 CGM Component Specifications
20.9.2 CGM Electrical Specifications
Characteristic Symbol Min Typ Max Unit
External clock
f
XCLK
30 32.768 100 kHz
Crystal load capacitance
(1)
1. Crystal manufacturer value
C
L
— 12.5 — pF
Crystal fixed capacitance
(2)
2. Capacitor on OSC1 pin. Does not include parasitic capacitance due to package, pin, and board.
C
1
—
15
—pF
Crystal tuning capacitance
C
2
—
15
—pF
Feedback bias resistor
R
B
11022MΩ
Series resistor
(3)
3. Capacitor on OSC2 pin. Does not include parasitic capacitance due to package, pin, and board.
R
S
100 330 470 kΩ
Description Symbol Min Typ Max Unit
Operating voltage
V
DD
3.0 — 5.5 V
Operating temperature T –40 25 125
o
C
Crystal reference frequency
f
RCLK
30 32.768 100 kHz
Range nominal multiplier
f
NOM
— 38.4 — kHz
VCO center-of-range frequency
(1)
1. 5.0 V ± 10% V
DD
f
VRS
38.4 k — 40.0 M Hz
Medium-voltage VCO center-of-range frequency
(2)
2. 3.3 V ± 10% V
DD
f
VRS
38.4 k — 40.0 M Hz
VCO range linear range multiplier L 1 — 255
VCO power-of-two range multiplier
2
E
1—4
VCO multiply factor N 1 — 4095
VCO prescale multiplier
2
P
118
Reference divider factor R 1 1 15
VCO operating frequency
f
VCLK
38.4 k — 40.0 M Hz
Bus operating frequency
(1)
f
BUS
——8.2MHz
Bus frequency @ medium voltage
(2)
f
BUS
——4.1MHz
Manual acquisition time
t
Lock
——50ms
Automatic lock time
t
Lock
——50ms
PLL jitter
(3)
3. Deviation of average bus frequency over 2 ms. N = VCO multiplier.
f
J
0—
f
RCLK
x
0.025% x
2
P
N/4
Hz
External clock input frequency
PLL disabled
f
OSC
dc — 32.8 M Hz
External clock input frequency
PLL enabled
f
OSC
30 k — 1.5 M Hz