Datasheet
Table Of Contents
- Revision History
- List of Chapters
- Table of Contents
- Chapter 1 General Description
- 1.1 Introduction
- 1.2 Features
- 1.3 MCU Block Diagram
- 1.4 Pin Assignments
- 1.5 Pin Functions
- 1.5.1 Power Supply Pins (VDD and VSS)
- 1.5.2 Oscillator Pins (OSC1 and OSC2)
- 1.5.3 External Reset Pin (RST)
- 1.5.4 External Interrupt Pin (IRQ)
- 1.5.5 CGM Power Supply Pins (VDDA and VSSA)
- 1.5.6 External Filter Capacitor Pin (CGMXFC)
- 1.5.7 ADC Power Supply/Reference Pins (VDDAD/VREFH and VSSAD/VREFL)
- 1.5.8 Port A Input/Output (I/O) Pins (PTA7/KBD7/AD15-PTA0/KBD0/AD8)
- 1.5.9 Port B I/O Pins (PTB7/AD7-PTB0/AD0)
- 1.5.10 Port C I/O Pins (PTC6-PTC0)
- 1.5.11 Port D I/O Pins (PTD7/T2CH1-PTD0/SS)
- 1.5.12 Port E I/O Pins (PTE5-PTE2, PTE1/RxD, and PTE0/TxD)
- 1.5.13 Port F I/O Pins (PTF7/T2CH5-PTF0)
- 1.5.14 Port G I/O Pins (PTG7/AD23-PTBG0/AD16)
- 1.5.15 Unused Pin Termination
- Chapter 2 Memory
- 2.1 Introduction
- 2.2 Unimplemented Memory Locations
- 2.3 Reserved Memory Locations
- 2.4 Input/Output (I/O) Section
- 2.5 Random-Access Memory (RAM)
- 2.6 FLASH-1 Memory (FLASH-1)
- 2.7 FLASH-2 Memory (FLASH-2)
- Chapter 3 Analog-to-Digital Converter (ADC)
- Chapter 4 Clock Generator Module (CGM)
- 4.1 Introduction
- 4.2 Features
- 4.3 Functional Description
- 4.4 I/O Signals
- 4.4.1 Crystal Amplifier Input Pin (OSC1)
- 4.4.2 Crystal Amplifier Output Pin (OSC2)
- 4.4.3 External Filter Capacitor Pin (CGMXFC)
- 4.4.4 PLL Analog Power Pin (Vdda)
- 4.4.5 PLL Analog Ground Pin (Vssa)
- 4.4.6 Oscillator Enable Signal (SIMOSCEN)
- 4.4.7 Oscillator Enable in Stop Mode Bit (OSCENINSTOP)
- 4.4.8 Crystal Output Frequency Signal (CGMXCLK)
- 4.4.9 CGM Base Clock Output (CGMOUT)
- 4.4.10 CGM CPU Interrupt (CGMINT)
- 4.5 CGM Registers
- 4.6 Interrupts
- 4.7 Special Modes
- 4.8 Acquisition/Lock Time Specifications
- Chapter 5 Configuration Register (CONFIG)
- Chapter 6 Computer Operating Properly (COP) Module
- Chapter 7 Central Processor Unit (CPU)
- Chapter 8 External Interrupt (IRQ)
- Chapter 9 Keyboard Interrupt Module (KBI)
- Chapter 10 Low-Power Modes
- 10.1 Introduction
- 10.2 Analog-to-Digital Converter (ADC)
- 10.3 Break Module (BRK)
- 10.4 Central Processor Unit (CPU)
- 10.5 Clock Generator Module (CGM)
- 10.6 Computer Operating Properly Module (COP)
- 10.7 External Interrupt Module (IRQ)
- 10.8 Keyboard Interrupt Module (KBI)
- 10.9 Low-Voltage Inhibit Module (LVI)
- 10.10 Enhanced Serial Communications Interface Module (ESCI)
- 10.11 Serial Peripheral Interface Module (SPI)
- 10.12 Timer Interface Module (TIM1 and TIM2)
- 10.13 Timebase Module (TBM)
- 10.14 Exiting Wait Mode
- 10.15 Exiting Stop Mode
- Chapter 11 Low-Voltage Inhibit (LVI)
- Chapter 12 Input/Output (I/O) Ports
- Chapter 13 Enhanced Serial Communications Interface (ESCI) Module
- Chapter 14 System Integration Module (SIM)
- Chapter 15 Serial Peripheral Interface (SPI) Module
- Chapter 16 Timebase Module (TBM)
- Chapter 17 Timer Interface Module (TIM1)
- Chapter 18 Timer Interface Module (TIM2)
- Chapter 19 Development Support
- Chapter 20 Electrical Specifications
- 20.1 Introduction
- 20.2 Absolute Maximum Ratings
- 20.3 Functional Operating Range
- 20.4 Thermal Characteristics
- 20.5 5.0-Vdc Electrical Characteristics
- 20.6 3.3-Vdc Electrical Characteristics
- 20.7 5.0-Volt Control Timing
- 20.8 3.3-Volt Control Timing
- 20.9 Clock Generation Module (CGM) Characteristics
- 20.10 5.0-Volt ADC Characteristics
- 20.11 3.3-Volt ADC Characteristics
- 20.12 5.0-Volt SPI Characteristics
- 20.13 3.3-Volt SPI Characteristics
- 20.14 Timer Interface Module Characteristics
- 20.15 Memory Characteristics
- Chapter 21 Ordering Information and Mechanical Specifications
- Appendix A MC68HC908GR48A
- Appendix B MC68HC908GR32A
Electrical Specifications
MC68HC908GR60A • MC68HC908GR48A • MC68HC908GR32A Data Sheet, Rev. 5
282 Freescale Semiconductor
Pullup/pulldown resistors (as input only)
Ports PTA7/KBD7–PTA0/KBD0, PTC6–PTC0,
PTD7/T2CH1–PTD0/SS
R
PU
20 45 65 kΩ
Capacitance
Ports (as input or output)
C
Out
C
In
—
—
—
—
12
8
pF
Monitor mode entry voltage
V
TST
V
DD
+ 2.5
—
V
DD
+ 4.0
V
Low-voltage inhibit, trip falling voltage
V
TRIPF
2.35 2.6 2.8 V
Low-voltage inhibit, trip rising voltage
V
TRIPR
2.4 2.66 2.9 V
Low-voltage inhibit reset/recover hysteresis
(V
TRIPF
+ V
HYS
= V
TRIPR
)
V
HYS
—100 —mV
POR rearm voltage
(12)
V
POR
0 — 100 mV
POR reset voltage
(13)
V
PORRST
0 700 800 mV
POR rise time ramp rate
(14)
R
POR
0.02 — — V/ms
1. V
DD
= 3.3 Vdc ± 10%, V
SS
= 0 Vdc, T
A
= T
A
(min) to T
A
(max), unless otherwise noted
2. Typical values reflect average measurements at midpoint of voltage range, 25°C only.
3. Run (operating) I
DD
measured using external square wave clock source (f
OSC
= 16 MHz). All inputs 0.2 V from rail. No dc
loads. Less than 100 pF on all outputs. C
L
= 20 pF on OSC2. All ports configured as inputs. OSC2 capacitance linearly
affects run I
DD
. Measured with all modules enabled.
4. Wait I
DD
measured using external square wave clock source (f
OSC
= 16 MHz). All inputs 0.2 V from rail. No dc loads. Less
than 100 pF on all outputs. C
L
= 20 pF on OSC2. All ports configured as inputs. OSC2 capacitance linearly affects wait
I
DD
. Measured with CGM and LVI enabled.
5. Stop I
DD
is measured with OSC1 = V
SS
. All inputs 0.2 V from rail. No dc loads. Less than 100 pF on all outputs. All ports
configured as inputs. Typical values at midpoint of voltage range, 25°C only.
6. Stop I
DD
with TBM enabled is measured using an external square wave clock source (f
OSC
= 4 MHz). All inputs 0.2 V from
rail. No dc loads. Less than 100 pF on all outputs. All inputs configured as inputs.
7. This parameter is characterized and not tested on each device.
8. All functional non-supply pins are internally clamped to V
SS
and V
DD
.
9. Input must be current limited to the value specified. To determine the value of the required current-limiting resistor,
calculate resistance values for positive and negative clamp voltages, then use the larger of the two values.
10. Power supply must maintain regulation within operating V
DD
range during instantaneous and operating maximum current
conditions. If positive injection current (V
in
> V
DD
) is greater than I
DD
, the injection current may flow out of V
DD
and could
result in external power supply going out of regulation. Ensure external V
DD
load will shunt current greater than maximum
injection current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock
is present, or if clock rate is very low (which would reduce overall power consumption).
11. Pullups and pulldowns are disabled.
12. Maximum is highest voltage that POR is guaranteed.
13. Maximum is highest voltage that POR is possible.
14. If minimum V
DD
is not reached before the internal POR reset is released, RST must be driven low externally until minimum
V
DD
is reached.
Characteristic
(1)
Symbol Min
Typ
(2)
Max Unit
