Datasheet

ManualsBrandsNXP SEMICONDUCTORS ManualsMicrocontrollers, Microprocessors & QuartzesEmbedded microcontroller LQFP 48 (7x7) 8-Bit 8 MHz I/O number 37

Table Of Contents

Revision History
List of Chapters
Table of Contents
Chapter 1 General Description
- 1.1 Introduction
- 1.2 Features
  - 1.2.1 Standard Features
  - 1.2.2 Features of the CPU08
- 1.3 MCU Block Diagram
- 1.4 Pin Assignments
- 1.5 Pin Functions
Chapter 2 Memory
- 2.1 Introduction
- 2.2 Unimplemented Memory Locations
- 2.3 Reserved Memory Locations
- 2.4 Input/Output (I/O) Section
- 2.5 Random-Access Memory (RAM)
- 2.6 FLASH-1 Memory (FLASH-1)
- 2.7 FLASH-2 Memory (FLASH-2)
Chapter 3 Analog-to-Digital Converter (ADC)
- 3.1 Introduction
- 3.2 Features
- 3.3 Functional Description
- 3.4 Monotonicity
- 3.5 Interrupts
- 3.6 Low-Power Modes
  - 3.6.1 Wait Mode
  - 3.6.2 Stop Mode
- 3.7 I/O Signals
- 3.8 I/O Registers
Chapter 4 Clock Generator Module (CGM)
- 4.1 Introduction
- 4.2 Features
- 4.3 Functional Description
- 4.4 I/O Signals
- 4.5 CGM Registers
- 4.6 Interrupts
- 4.7 Special Modes
- 4.8 Acquisition/Lock Time Specifications
Chapter 5 Configuration Register (CONFIG)
- 5.1 Introduction
- 5.2 Functional Description
Chapter 6 Computer Operating Properly (COP) Module
- 6.1 Introduction
- 6.2 Functional Description
- 6.3 I/O Signals
- 6.4 COP Control Register
- 6.5 Interrupts
- 6.6 Monitor Mode
- 6.7 Low-Power Modes
  - 6.7.1 Wait Mode
  - 6.7.2 Stop Mode
- 6.8 COP Module During Break Mode
Chapter 7 Central Processor Unit (CPU)
- 7.1 Introduction
- 7.2 Features
- 7.3 CPU Registers
- 7.4 Arithmetic/Logic Unit (ALU)
- 7.5 Low-Power Modes
  - 7.5.1 Wait Mode
  - 7.5.2 Stop Mode
- 7.6 CPU During Break Interrupts
- 7.7 Instruction Set Summary
- 7.8 Opcode Map
Chapter 8 External Interrupt (IRQ)
- 8.1 Introduction
- 8.2 Features
- 8.3 Functional Description
- 8.4 IRQ Pin
- 8.5 IRQ Module During Break Interrupts
- 8.6 IRQ Status and Control Register
Chapter 9 Keyboard Interrupt Module (KBI)
- 9.1 Introduction
- 9.2 Features
- 9.3 Functional Description
- 9.4 Keyboard Initialization
- 9.5 Low-Power Modes
  - 9.5.1 Wait Mode
  - 9.5.2 Stop Mode
- 9.6 Keyboard Module During Break Interrupts
- 9.7 I/O Registers
Chapter 10 Low-Power Modes
- 10.1 Introduction
  - 10.1.1 Wait Mode
  - 10.1.2 Stop Mode
- 10.2 Analog-to-Digital Converter (ADC)
  - 10.2.1 Wait Mode
  - 10.2.2 Stop Mode
- 10.3 Break Module (BRK)
  - 10.3.1 Wait Mode
  - 10.3.2 Stop Mode
- 10.4 Central Processor Unit (CPU)
  - 10.4.1 Wait Mode
  - 10.4.2 Stop Mode
- 10.5 Clock Generator Module (CGM)
  - 10.5.1 Wait Mode
  - 10.5.2 Stop Mode
- 10.6 Computer Operating Properly Module (COP)
  - 10.6.1 Wait Mode
  - 10.6.2 Stop Mode
- 10.7 External Interrupt Module (IRQ)
  - 10.7.1 Wait Mode
  - 10.7.2 Stop Mode
- 10.8 Keyboard Interrupt Module (KBI)
  - 10.8.1 Wait Mode
  - 10.8.2 Stop Mode
- 10.9 Low-Voltage Inhibit Module (LVI)
  - 10.9.1 Wait Mode
  - 10.9.2 Stop Mode
- 10.10 Enhanced Serial Communications Interface Module (ESCI)
  - 10.10.1 Wait Mode
  - 10.10.2 Stop Mode
- 10.11 Serial Peripheral Interface Module (SPI)
  - 10.11.1 Wait Mode
  - 10.11.2 Stop Mode
- 10.12 Timer Interface Module (TIM1 and TIM2)
  - 10.12.1 Wait Mode
  - 10.12.2 Stop Mode
- 10.13 Timebase Module (TBM)
  - 10.13.1 Wait Mode
  - 10.13.2 Stop Mode
- 10.14 Exiting Wait Mode
- 10.15 Exiting Stop Mode
Chapter 11 Low-Voltage Inhibit (LVI)
- 11.1 Introduction
- 11.2 Features
- 11.3 Functional Description
- 11.4 LVI Status Register
- 11.5 LVI Interrupts
- 11.6 Low-Power Modes
  - 11.6.1 Wait Mode
  - 11.6.2 Stop Mode
Chapter 12 Input/Output (I/O) Ports
- 12.1 Introduction
- 12.2 Unused Pin Termination
- 12.3 Port A
- 12.4 Port B
  - 12.4.1 Port B Data Register
  - 12.4.2 Data Direction Register B
- 12.5 Port C
- 12.6 Port D
- 12.7 Port E
  - 12.7.1 Port E Data Register
  - 12.7.2 Data Direction Register E
- 12.8 Port F
  - 12.8.1 Port F Data Register
  - 12.8.2 Data Direction Register F
- 12.9 Port G
  - 12.9.1 Port G Data Register
  - 12.9.2 Data Direction Register G
Chapter 13 Enhanced Serial Communications Interface (ESCI) Module
- 13.1 Introduction
- 13.2 Features
- 13.3 Pin Name Conventions
- 13.4 Functional Description
- 13.5 Low-Power Modes
  - 13.5.1 Wait Mode
  - 13.5.2 Stop Mode
- 13.6 ESCI During Break Module Interrupts
- 13.7 I/O Signals
  - 13.7.1 PTE0/TxD (Transmit Data)
  - 13.7.2 PTE1/RxD (Receive Data)
- 13.8 I/O Registers
- 13.9 ESCI Arbiter
Chapter 14 System Integration Module (SIM)
- 14.1 Introduction
- 14.2 SIM Bus Clock Control and Generation
- 14.3 Reset and System Initialization
  - 14.3.1 External Pin Reset
  - 14.3.2 Active Resets from Internal Sources
- 14.4 SIM Counter
- 14.5 Exception Control
- 14.6 Low-Power Modes
  - 14.6.1 Wait Mode
  - 14.6.2 Stop Mode
- 14.7 SIM Registers
Chapter 15 Serial Peripheral Interface (SPI) Module
- 15.1 Introduction
- 15.2 Features
- 15.3 Functional Description
  - 15.3.1 Master Mode
  - 15.3.2 Slave Mode
- 15.4 Transmission Formats
- 15.5 Queuing Transmission Data
- 15.6 Error Conditions
  - 15.6.1 Overflow Error
  - 15.6.2 Mode Fault Error
- 15.7 Interrupts
- 15.8 Resetting the SPI
- 15.9 Low-Power Modes
  - 15.9.1 Wait Mode
  - 15.9.2 Stop Mode
- 15.10 SPI During Break Interrupts
- 15.11 I/O Signals
- 15.12 I/O Registers
Chapter 16 Timebase Module (TBM)
- 16.1 Introduction
- 16.2 Features
- 16.3 Functional Description
- 16.4 Interrupts
- 16.5 TBM Interrupt Rate
- 16.6 Low-Power Modes
  - 16.6.1 Wait Mode
  - 16.6.2 Stop Mode
- 16.7 Timebase Control Register
Chapter 17 Timer Interface Module (TIM1)
- 17.1 Introduction
- 17.2 Features
- 17.3 Functional Description
- 17.4 Interrupts
- 17.5 Wait Mode
- 17.6 TIM1 During Break Interrupts
- 17.7 Input/Output Signals
- 17.8 Input/Output Registers
Chapter 18 Timer Interface Module (TIM2)
- 18.1 Introduction
- 18.2 Features
- 18.3 Functional Description
- 18.4 Interrupts
- 18.5 Low-Power Modes
  - 18.5.1 Wait Mode
  - 18.5.2 Stop Mode
- 18.6 TIM2 During Break Interrupts
- 18.7 I/O Signals
  - 18.7.1 TIM2 Clock Pin (T2CH0)
  - 18.7.2 TIM2 Channel I/O Pins (T2CH5:T2CH2 and T2CH1:T2CH0)
- 18.8 I/O Registers
Chapter 19 Development Support
- 19.1 Introduction
- 19.2 Break Module (BRK)
- 19.3 Monitor Module (MON)
  - 19.3.1 Functional Description
  - 19.3.2 Security
Chapter 20 Electrical Specifications
- 20.1 Introduction
- 20.2 Absolute Maximum Ratings
- 20.3 Functional Operating Range
- 20.4 Thermal Characteristics
- 20.5 5.0-Vdc Electrical Characteristics
- 20.6 3.3-Vdc Electrical Characteristics
- 20.7 5.0-Volt Control Timing
- 20.8 3.3-Volt Control Timing
- 20.9 Clock Generation Module (CGM) Characteristics
- 20.10 5.0-Volt ADC Characteristics
- 20.11 3.3-Volt ADC Characteristics
- 20.12 5.0-Volt SPI Characteristics
- 20.13 3.3-Volt SPI Characteristics
- 20.14 Timer Interface Module Characteristics
- 20.15 Memory Characteristics
Chapter 21 Ordering Information and Mechanical Specifications
- 21.1 Introduction
- 21.2 MC Order Numbers
- 21.3 Package Dimensions
Appendix A MC68HC908GR48A
- A.1 Introduction
- A.2 Block Diagram
- A.3 Memory
- A.4 Ordering Information
Appendix B MC68HC908GR32A
- B.1 Introduction
- B.2 Block Diagram
- B.3 Memory
- B.4 Ordering Information

Random-Access Memory (RAM)

MC68HC908GR60A • MC68HC908GR48A • MC68HC908GR32A Data Sheet, Rev. 5

Freescale Semiconductor 41

2.5 Random-Access Memory (RAM)

The RAM locations are broken into two non-continuous memory blocks. The RAM addresses locations

are $0040–$043F and $0580–$097F. The location of the stack RAM is programmable. The 16-bit stack

pointer allows the stack to be anywhere in the 64-Kbyte memory space.

NOTE

For correct operation, the stack pointer must point only to RAM locations.

Within page zero are 192 bytes of RAM. Because the location of the stack RAM is programmable, all page

zero RAM locations can be used for I/O control and user data or code. When the stack pointer is moved

from its reset location at $00FF out of page zero, direct addressing mode instructions can efficiently

access all page zero RAM locations. Page zero RAM, therefore, provides ideal locations for frequently

accessed global variables.

Before processing an interrupt, the CPU uses five bytes of the stack to save the contents of the CPU

registers.

NOTE

For M6805 compatibility, the H register is not stacked.

During a subroutine call, the CPU uses two bytes of the stack to store the return address. The stack

pointer decrements during pushes and increments during pulls.

NOTE

Be careful when using nested subroutines. The CPU may overwrite data in

the RAM during a subroutine or during the interrupt stacking operation.

2.6 FLASH-1 Memory (FLASH-1)

This subsection describes the operation of the embedded FLASH-1 memory. This memory can be read,

programmed, and erased from a single external supply. The program and erase operations are enabled

through the use of an internal charge pump.

2.6.1 Functional Description

The FLASH-1 memory is an array of 32,256 bytes with two bytes of block protection (one byte for

protecting areas within FLASH-1 array and one byte for protecting areas within FLASH-2 array) and an

additional 52 bytes of user vectors. An erased bit reads as a 1 and a programmed bit reads as a 0.

Memory in the FLASH-1 array is organized into rows within pages. There are two rows of memory per

page with 64 bytes per row. The minimum erase block size is a single page,128 bytes. Programming is

performed on a per-row basis, 64 bytes at a time. Program and erase operations are facilitated through

control bits in the FLASH-1 control register (FL1CR). Details for these operations appear later in this

subsection.

The FLASH-1 memory map consists of:

• $8000–$FDFF: user memory (32,256 bytes)

• $FF80: FLASH-1 block protect register (FL1BPR)

• $FF81: FLASH-2 block protect register (FL2BPR)

• $FF88: FLASH-1 control register (FL1CR)

• $FFCC–$FFFF: these locations are reserved for user-defined interrupt and reset vectors (see

Table 2-1 for details)