Datasheet
Table Of Contents
- Revision History
- List of Chapters
- Table of Contents
- Chapter 1 General Description
- 1.1 Introduction
- 1.2 Features
- 1.3 MCU Block Diagram
- 1.4 Pin Assignments
- 1.5 Pin Functions
- 1.5.1 Power Supply Pins (VDD and VSS)
- 1.5.2 Oscillator Pins (OSC1 and OSC2)
- 1.5.3 External Reset Pin (RST)
- 1.5.4 External Interrupt Pin (IRQ)
- 1.5.5 CGM Power Supply Pins (VDDA and VSSA)
- 1.5.6 External Filter Capacitor Pin (CGMXFC)
- 1.5.7 ADC Power Supply/Reference Pins (VDDAD/VREFH and VSSAD/VREFL)
- 1.5.8 Port A Input/Output (I/O) Pins (PTA7/KBD7/AD15-PTA0/KBD0/AD8)
- 1.5.9 Port B I/O Pins (PTB7/AD7-PTB0/AD0)
- 1.5.10 Port C I/O Pins (PTC6-PTC0)
- 1.5.11 Port D I/O Pins (PTD7/T2CH1-PTD0/SS)
- 1.5.12 Port E I/O Pins (PTE5-PTE2, PTE1/RxD, and PTE0/TxD)
- 1.5.13 Port F I/O Pins (PTF7/T2CH5-PTF0)
- 1.5.14 Port G I/O Pins (PTG7/AD23-PTBG0/AD16)
- 1.5.15 Unused Pin Termination
- Chapter 2 Memory
- 2.1 Introduction
- 2.2 Unimplemented Memory Locations
- 2.3 Reserved Memory Locations
- 2.4 Input/Output (I/O) Section
- 2.5 Random-Access Memory (RAM)
- 2.6 FLASH-1 Memory (FLASH-1)
- 2.7 FLASH-2 Memory (FLASH-2)
- Chapter 3 Analog-to-Digital Converter (ADC)
- Chapter 4 Clock Generator Module (CGM)
- 4.1 Introduction
- 4.2 Features
- 4.3 Functional Description
- 4.4 I/O Signals
- 4.4.1 Crystal Amplifier Input Pin (OSC1)
- 4.4.2 Crystal Amplifier Output Pin (OSC2)
- 4.4.3 External Filter Capacitor Pin (CGMXFC)
- 4.4.4 PLL Analog Power Pin (Vdda)
- 4.4.5 PLL Analog Ground Pin (Vssa)
- 4.4.6 Oscillator Enable Signal (SIMOSCEN)
- 4.4.7 Oscillator Enable in Stop Mode Bit (OSCENINSTOP)
- 4.4.8 Crystal Output Frequency Signal (CGMXCLK)
- 4.4.9 CGM Base Clock Output (CGMOUT)
- 4.4.10 CGM CPU Interrupt (CGMINT)
- 4.5 CGM Registers
- 4.6 Interrupts
- 4.7 Special Modes
- 4.8 Acquisition/Lock Time Specifications
- Chapter 5 Configuration Register (CONFIG)
- Chapter 6 Computer Operating Properly (COP) Module
- Chapter 7 Central Processor Unit (CPU)
- Chapter 8 External Interrupt (IRQ)
- Chapter 9 Keyboard Interrupt Module (KBI)
- Chapter 10 Low-Power Modes
- 10.1 Introduction
- 10.2 Analog-to-Digital Converter (ADC)
- 10.3 Break Module (BRK)
- 10.4 Central Processor Unit (CPU)
- 10.5 Clock Generator Module (CGM)
- 10.6 Computer Operating Properly Module (COP)
- 10.7 External Interrupt Module (IRQ)
- 10.8 Keyboard Interrupt Module (KBI)
- 10.9 Low-Voltage Inhibit Module (LVI)
- 10.10 Enhanced Serial Communications Interface Module (ESCI)
- 10.11 Serial Peripheral Interface Module (SPI)
- 10.12 Timer Interface Module (TIM1 and TIM2)
- 10.13 Timebase Module (TBM)
- 10.14 Exiting Wait Mode
- 10.15 Exiting Stop Mode
- Chapter 11 Low-Voltage Inhibit (LVI)
- Chapter 12 Input/Output (I/O) Ports
- Chapter 13 Enhanced Serial Communications Interface (ESCI) Module
- Chapter 14 System Integration Module (SIM)
- Chapter 15 Serial Peripheral Interface (SPI) Module
- Chapter 16 Timebase Module (TBM)
- Chapter 17 Timer Interface Module (TIM1)
- Chapter 18 Timer Interface Module (TIM2)
- Chapter 19 Development Support
- Chapter 20 Electrical Specifications
- 20.1 Introduction
- 20.2 Absolute Maximum Ratings
- 20.3 Functional Operating Range
- 20.4 Thermal Characteristics
- 20.5 5.0-Vdc Electrical Characteristics
- 20.6 3.3-Vdc Electrical Characteristics
- 20.7 5.0-Volt Control Timing
- 20.8 3.3-Volt Control Timing
- 20.9 Clock Generation Module (CGM) Characteristics
- 20.10 5.0-Volt ADC Characteristics
- 20.11 3.3-Volt ADC Characteristics
- 20.12 5.0-Volt SPI Characteristics
- 20.13 3.3-Volt SPI Characteristics
- 20.14 Timer Interface Module Characteristics
- 20.15 Memory Characteristics
- Chapter 21 Ordering Information and Mechanical Specifications
- Appendix A MC68HC908GR48A
- Appendix B MC68HC908GR32A
Memory
MC68HC908GR60A • MC68HC908GR48A • MC68HC908GR32A Data Sheet, Rev. 5
48 Freescale Semiconductor
E. The time between each FLASH address change (step 7 to step 7), or the time between the last FLASH
address programmed to clearing the PGM bit (step 7 to step 10) must not exceed the maximum
programming time, t
PROG
maximum.
F. Be cautious when programming the FLASH-1 array to ensure that non-FLASH locations are not used
as the address that is written to when selecting either the desired row address range in step 3 of the
algorithm or the byte to be programmed in step 7 of the algorithm.
2.6.7 Low-Power Modes
The WAIT and STOP instructions will place the MCU in low power-consumption standby modes.
2.6.7.1 Wait Mode
Putting the MCU into wait mode while the FLASH is in read mode does not affect the operation of the
FLASH memory directly; however, no memory activity will take place since the CPU is inactive.
The WAIT instruction should not be executed while performing a program or erase operation on the
FLASH. Wait mode will suspend any FLASH program/erase operations and leave the memory in a
standby mode.
2.6.7.2 Stop Mode
Putting the MCU into stop mode while the FLASH is in read mode does not affect the operation of the
FLASH memory directly; however, no memory activity will take place since the CPU is inactive.
The STOP instruction should not be executed while performing a program or erase operation on the
FLASH. Stop mode will suspend any FLASH program/erase operations and leave the memory in a
standby mode.
NOTE
Standby mode is the power saving mode of the FLASH module, in which all
internal control signals to the FLASH are inactive and the current
consumption of the FLASH is minimum.
