Datasheet
Table Of Contents
- Revision History
- List of Chapters
- Table of Contents
- Chapter 1 General Description
- 1.1 Introduction
- 1.2 Features
- 1.3 MCU Block Diagram
- 1.4 Pin Assignments
- 1.5 Pin Functions
- 1.5.1 Power Supply Pins (VDD and VSS)
- 1.5.2 Oscillator Pins (OSC1 and OSC2)
- 1.5.3 External Reset Pin (RST)
- 1.5.4 External Interrupt Pin (IRQ)
- 1.5.5 CGM Power Supply Pins (VDDA and VSSA)
- 1.5.6 External Filter Capacitor Pin (CGMXFC)
- 1.5.7 ADC Power Supply/Reference Pins (VDDAD/VREFH and VSSAD/VREFL)
- 1.5.8 Port A Input/Output (I/O) Pins (PTA7/KBD7/AD15-PTA0/KBD0/AD8)
- 1.5.9 Port B I/O Pins (PTB7/AD7-PTB0/AD0)
- 1.5.10 Port C I/O Pins (PTC6-PTC0)
- 1.5.11 Port D I/O Pins (PTD7/T2CH1-PTD0/SS)
- 1.5.12 Port E I/O Pins (PTE5-PTE2, PTE1/RxD, and PTE0/TxD)
- 1.5.13 Port F I/O Pins (PTF7/T2CH5-PTF0)
- 1.5.14 Port G I/O Pins (PTG7/AD23-PTBG0/AD16)
- 1.5.15 Unused Pin Termination
- Chapter 2 Memory
- 2.1 Introduction
- 2.2 Unimplemented Memory Locations
- 2.3 Reserved Memory Locations
- 2.4 Input/Output (I/O) Section
- 2.5 Random-Access Memory (RAM)
- 2.6 FLASH-1 Memory (FLASH-1)
- 2.7 FLASH-2 Memory (FLASH-2)
- Chapter 3 Analog-to-Digital Converter (ADC)
- Chapter 4 Clock Generator Module (CGM)
- 4.1 Introduction
- 4.2 Features
- 4.3 Functional Description
- 4.4 I/O Signals
- 4.4.1 Crystal Amplifier Input Pin (OSC1)
- 4.4.2 Crystal Amplifier Output Pin (OSC2)
- 4.4.3 External Filter Capacitor Pin (CGMXFC)
- 4.4.4 PLL Analog Power Pin (Vdda)
- 4.4.5 PLL Analog Ground Pin (Vssa)
- 4.4.6 Oscillator Enable Signal (SIMOSCEN)
- 4.4.7 Oscillator Enable in Stop Mode Bit (OSCENINSTOP)
- 4.4.8 Crystal Output Frequency Signal (CGMXCLK)
- 4.4.9 CGM Base Clock Output (CGMOUT)
- 4.4.10 CGM CPU Interrupt (CGMINT)
- 4.5 CGM Registers
- 4.6 Interrupts
- 4.7 Special Modes
- 4.8 Acquisition/Lock Time Specifications
- Chapter 5 Configuration Register (CONFIG)
- Chapter 6 Computer Operating Properly (COP) Module
- Chapter 7 Central Processor Unit (CPU)
- Chapter 8 External Interrupt (IRQ)
- Chapter 9 Keyboard Interrupt Module (KBI)
- Chapter 10 Low-Power Modes
- 10.1 Introduction
- 10.2 Analog-to-Digital Converter (ADC)
- 10.3 Break Module (BRK)
- 10.4 Central Processor Unit (CPU)
- 10.5 Clock Generator Module (CGM)
- 10.6 Computer Operating Properly Module (COP)
- 10.7 External Interrupt Module (IRQ)
- 10.8 Keyboard Interrupt Module (KBI)
- 10.9 Low-Voltage Inhibit Module (LVI)
- 10.10 Enhanced Serial Communications Interface Module (ESCI)
- 10.11 Serial Peripheral Interface Module (SPI)
- 10.12 Timer Interface Module (TIM1 and TIM2)
- 10.13 Timebase Module (TBM)
- 10.14 Exiting Wait Mode
- 10.15 Exiting Stop Mode
- Chapter 11 Low-Voltage Inhibit (LVI)
- Chapter 12 Input/Output (I/O) Ports
- Chapter 13 Enhanced Serial Communications Interface (ESCI) Module
- Chapter 14 System Integration Module (SIM)
- Chapter 15 Serial Peripheral Interface (SPI) Module
- Chapter 16 Timebase Module (TBM)
- Chapter 17 Timer Interface Module (TIM1)
- Chapter 18 Timer Interface Module (TIM2)
- Chapter 19 Development Support
- Chapter 20 Electrical Specifications
- 20.1 Introduction
- 20.2 Absolute Maximum Ratings
- 20.3 Functional Operating Range
- 20.4 Thermal Characteristics
- 20.5 5.0-Vdc Electrical Characteristics
- 20.6 3.3-Vdc Electrical Characteristics
- 20.7 5.0-Volt Control Timing
- 20.8 3.3-Volt Control Timing
- 20.9 Clock Generation Module (CGM) Characteristics
- 20.10 5.0-Volt ADC Characteristics
- 20.11 3.3-Volt ADC Characteristics
- 20.12 5.0-Volt SPI Characteristics
- 20.13 3.3-Volt SPI Characteristics
- 20.14 Timer Interface Module Characteristics
- 20.15 Memory Characteristics
- Chapter 21 Ordering Information and Mechanical Specifications
- Appendix A MC68HC908GR48A
- Appendix B MC68HC908GR32A
FLASH-2 Memory (FLASH-2)
MC68HC908GR60A • MC68HC908GR48A • MC68HC908GR32A Data Sheet, Rev. 5
Freescale Semiconductor 53
When bits within FL2BPR are programmed (0), they lock a block of memory address ranges as shown in
2.7.2.2 FLASH-2 Block Protect Register. If FL2BPR is programmed with any value other than $FF, the
protected block of FLASH memory can not be erased or programmed.
NOTE
The vector locations and the FLASH block protect registers are located in
the same page. FL1BPR and FL2BPR are not protected with special
hardware or software. Therefore, if this page is not protected by FL1BPR
and the vector locations are erased by either a page or a mass erase
operation, both FL1BPR and FL2BPR will also get erased.
2.7.4 FLASH-2 Mass Erase Operation
Use this step-by-step procedure to erase the entire FLASH-2 memory:
1. Set both the ERASE bit and the MASS bit in the FLASH-2 control register (FL2CR).
2. Read the FLASH-2 block protect register (FL2BPR).
NOTE
Mass erase is disabled whenever any block is protected (FL2BPR does not
equal $FF).
3. Write to any FLASH-2 address within the FLASH-2 array with any data.
4. Wait for a time, t
NVS
(minimum 10 μs).
5. Set the HVEN bit.
6. Wait for a time, t
MERASE
(minimum 4 ms).
7. Clear the ERASE and MASS bits.
8. Wait for a time, t
NVHL
(minimum 100 μs).
9. Clear the HVEN bit.
10. Wait for a time, t
RCV
, (typically 1 μs) after which the memory can be accessed in normal read mode.
NOTE
A. Programming and erasing of FLASH locations can not be performed by code being executed from the
same FLASH array.
B. While these operations must be performed in the order shown, other unrelated operations may occur
between the steps. However, care must be taken to ensure that these operations do not access any
address within the FLASH array memory space such as the COP control register (COPCTL) at
$FFFF.
C. It is highly recommended that interrupts be disabled during program/erase operations.
