Datasheet

MC68HC908JB8•MC68HC08JB8•MC68HC08JT8 — Rev. 2.3 Technical Data
Freescale Semiconductor Mechanical Specifications 263
Technical Data — MC68HC908JB8•MC68HC08JB8•MC68HC08JT8
Section 19. Mechanical Specifications
19.1 Contents
19.2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .263
19.3 44-Pin Plastic Quad Flat Pack (QFP) . . . . . . . . . . . . . . . . . . .264
19.4 28-Pin Small Outline Integrated Circuit (SOIC) . . . . . . . . . . .265
19.5 20-Pin Dual In-Line Package (PDIP) . . . . . . . . . . . . . . . . . . .265
19.6 20-Pin Small Outline Integrated Circuit (SOIC) . . . . . . . . . . .266
19.2 Introduction
This section gives the dimensions for:
• 44-pin plastic quad flat pack (case 824A)
• 28-pin small outline integrated circuit package (case 751F)
• 20-pin plastic dual in-line package (case 738)
• 20-pin small outline integrated circuit package (case 751D)