Datasheet

Mechanical Specifications
28-Pin Small Outline Integrated Circuit (SOIC)
MC68HC908JB8•MC68HC08JB8•MC68HC08JT8 — Rev. 2.3 Technical Data
Freescale Semiconductor Mechanical Specifications 265
19.4 28-Pin Small Outline Integrated Circuit (SOIC)
Figure 19-2. 28-Pin SOIC (Case 751F)
19.5 20-Pin Dual In-Line Package (PDIP)
Figure 19-3. 20-Pin PDIP (Case 738)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION.
ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
J
K
F
1
15
14
28
-A-
-B-
28X
14X
D
P
S
A
M
0.010 (0.25) B
S
T
M
0.010 (0.25) B
M
26X G
-T-
SEATING
PLANE
C
X 45R
M
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 17.80 18.05 0.701 0.711
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.41 0.90 0.016 0.035
G 1.27 BSC 0.050 BSC
J 0.23 0.32 0.009 0.013
K 0.13 0.29 0.005 0.011
M
P 10.01 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
0° 0°8° 8°
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J
20 PL
M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 25.66 27.171.010 1.070
B 6.10 6.600.240 0.260
C 3.81 4.570.150 0.180
D 0.39 0.550.015 0.022
G 2.54 BSC0.100 BSC
J 0.21 0.380.008 0.015
K 2.80 3.550.110 0.140
L 7.62 BSC0.300 BSC
M 0 15 0 15
N 0.51 1.010.020 0.040
E
1.27 1.770.050 0.070
1
11
10
20
–A–
SEATING
PLANE
K
N
FG
D
20 PL
–T–
M
A
M
0.25 (0.010) T
E
B
C
F
1.27 BSC0.050 BSC