Datasheet

Ordering Information and Mechanical Specifications
MC68HC908KX8 • MC68HC908KX2 • MC68HC08KX8 Data Sheet, Rev. 2.1
194 Freescale Semiconductor
18.3 16-Pin Plastic Dual In-Line Package (PDIP)
18.4 16-Pin Small Outline Package (SOIC)
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.760 18.80 19.30
B 0.245 0.260 6.23 6.60
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.050 0.070 1.27 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.120 0.140 3.05 3.55
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.015 0.035 0.39 0.88
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
5. MOLD FLASH OR PROTRUSIONS SHALL NOT
EXCEED 0.25 (0.010).
6. ROUNDED CORNERS OPTIONAL.
°°°°
18
16 9
-A-
-B-
F
H
16 PL
G
S
K
C
D
-T-
S
B
M
0.25 (0.010) A
S
T
SEATING
PLANE
L
M
J
D
14X
B16X
SEATING
PLANE
S
A
M
0.25 B
S
T
16 9
81
h X 45
°
M
B
M
0.25
H8X
E
B
A
e
T
A1
A
L
C
θ
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM MIN MAX
MILLIMETERS
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 10.15 10.45
E 7.40 7.60
e 1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
θ 0 7
°°