Datasheet

MC68HC912D60A — Rev. 3.1 Technical Data
Freescale Semiconductor Revision History 457
Technical Data — MC68HC912D60A
Revision History
23.8 Contents
23.9 Changes from Rev 2.0 to Rev 3.0 . . . . . . . . . . . . . . . . . . . . .457
23.10 Major Changes From Rev 1.0 to Rev 2.0 . . . . . . . . . . . . . . . .457
23.11 Major Changes From Rev 0.0 to Rev 1.0 . . . . . . . . . . . . . . . .458
23.9 Changes from Rev 2.0 to Rev 3.0
23.10 Major Changes From Rev 1.0 to Rev 2.0
Section Page (in Rev 3.0) Description of change
EEPROM 110 Note referring to bit 6 of SHADOW word has been modified.
Section Page (in Rev 2.0) Description of change
MC68HC912D60C and MC68HC912D60P devices added to document.
General Description 27
Order numbers added for MC68HC912D60C and
MC68HC912D60P devices
Pinout and Signal
Descriptions
38, 40
45
50
Note about TEST pin updated
Note added about consideration of crystal selection due to EMC
emissions
Description of TEST pin added as new section and to Table 3-2
Description of EXTAL and XTAL modified in Table 3-2.
Registers
64, 69
68
DSGN bit removed from ATD0CTL2/ATD1CTL2 registers
FPOPEN bit added to EEMCR register
Flash Memory
98
New paragraph added to overview about flash protection via
FPOPEN bit
104 New section 7.11 Flash protection bit FPOPEN added