Datasheet

Electrical Specifications
Technical Data MC68HC912DT128A — Rev 4.0
424 Electrical Specifications MOTOROLA
Table 21-3. DC Electrical Characteristics
V
DD
= 5.0 Vdc ±10%, V
SS
= 0 Vdc, T
A
= T
L
to T
H
, unless otherwise noted
Characteristic
Symbol
Min Max Unit
Input high voltage, all inputs
V
IH
0.7 × V
DD
V
DD
+ 0.3
V
Input low voltage, all inputs
V
IL
V
SS
−0.3 0.2 × V
DD
V
Output high voltage, all I/O and output pins except XTAL
Normal drive strength
I
OH
= −10.0 µA
I
OH
= −0.8 mA
Reduced drive strength
I
OH
= −4.0 µA
I
OH
= −0.3 mA
V
OH
V
DD
− 0.2
V
DD
− 0.8
V
DD
− 0.2
V
DD
− 0.8
—
—
—
—
V
V
V
V
Output low voltage, all I/O and output pins except XTAL
Normal drive strength
I
OL
= 10.0 µA
I
OL
= 1.6 mA
Reduced drive strength
I
OL
= 3.6 µA
I
OL
= 0.6 mA
V
OL
—
—
—
—
V
SS
+0.2
V
SS
+0.4
V
SS
+0.2
V
SS
+0.4
V
V
V
V
Input leakage current
(1)
V
in
= V
DD
or V
SS
All input only pins except IRQ, ATD
(2)
and V
FP
V
in
= V
DD
or V
SS
IRQ
I
in
—
—
±2.5
±10
µA
µA
Three-state leakage, I/O ports, BKGD, and RESET
I
OZ
— ±2.5 µA
Input capacitance
All input pins and ATD pins (non-sampling)
ATD pins (sampling)
All I/O pins
C
in
—
—
—
10
15
20
pF
pF
pF
Output load capacitance
All outputs except PS[7:4]
PS[7:4] when configured as SPI
C
L
—
—
90
200
pF
pF
Programmable active pull-up/pull-down current
IRQ
, XIRQ, DBE, LSTRB, R/W. ports A, B, H, J, K, P, S, T
MODA, MODB active pull down during reset
BKGD passive pull up
I
APU
50
50
50
500
500
500
µA
µA
µA
RAM standby voltage, power down V
SB
1.5 — V
RAM standby current I
SB
—50µA
1. Specification is for parts in the -40 to +85°C range. Higher temperature ranges will result in increased
current leakage.
2. See Table 21-5.
Frees
cale Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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