Datasheet

MC9RS08KA8 Series MCU Data Sheet, Rev. 4
Ordering Information
Freescale Semiconductor26
4 Ordering Information
This section contains ordering numbers for MC9RS08KA8 series devices. See below for an example of
the device numbering system.
5 Mechanical Drawings
This following pages contain mechanical specifications for MC9RS08KA8 series package options.
• 16-pin PDIP (plastic dual in-line pin)
• 16-pin W-SOIC (wide body small outline integrated circuit)
• 16-pin TSSOP (thin shrink sSmall outline package)
• 20-pin PDIP (plastic dual in-line pin)
• 20-pin W-SOIC (wide body small outline integrated circuit)
Table 17. Device Numbering System
Device Number
Memory Package
Flash RAM Type Designator Document No.
MC9RS08KA8
MC9RS08KA4
8K bytes
4K bytes
254 bytes
126 bytes
16 PDIP PG 98ASB42431B
16 W-SOIC WG 98ASB42567B
16 TSSOP TG 98ASH70247A
20 PDIP PJ 98ASB42899B
20 W-SOIC WJ 98ASB42343B
MC
Temperature range
Family
Memory
Status
Core
(C = –40 °C to 85 ° C)
(9 = Flash-Based)
9
RS08
KA XX
(MC = Fully qualified)
Package designator (See Tabl e 17)
8
Approximate memory size (in KB)
C