Datasheet

MC9S08AC16 Series Data Sheet, Rev. 9
6 Freescale Semiconductor
Revision History
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The following revision history table summarizes changes contained in this document. For your
convenience, the page number designators have been linked to the appropriate location.
Revision
Number
Revision
Date
Description of Changes
0 12/2007 Initial Release.
1 12/2007
Updated the package designators for the 32 LQFP and 44 LQFP to be LC and LD respec-
tively.
2 2/2008 Corrected the SPI block module to be V3.
3 3/2008 AC market launch.Verified that the ADC Temp Sensor values were correct.
4 5/2008
Incorporated general release edits and updates, revised the Stop2 and Stop3 max values,
added the RoHS logo, and updated the back cover addresses.
5 6/2008 Corrected the note in the TPM introduction.
6 7/2008
Changed all instances of S9S08AWxxA to MC9S08AWxxA except in Appendix B. Added
42SDIP package option.
7 5/2009
Corrected SPI registers in Ta ble 4- 2. Added V
BG
in Table A -6.
Corrected title of Tab le 6 -3, Figure 6-13, Figure 6-14, Ta ble 6-5 and Figure 6-19.
Added errata for the following sections:
• Throughout (remove stop1 instances)
• Ta bl e 4- 1
• Ta bl e 4- 2
• Section 9.2, “Keyboard Pin Sharing”
• Section 9.3, “Features
• Ta bl e A- 6
• Ta bl e A- 7
• Figure A-12
8 11/20/2009
Updated the whole document for MC9S08AW16A/MC9S08AW8A to support the third TPM
module.
Updated the TPM 1 channel to 4 for the 32-pin packages in the Tabl e 1- 1.
Updated the bit 2 of IRQSC register in the Ta ble 4- 2.
Updated the Temp Sensor Voltage in the Table A -9.
9 8/12/2011
Corrected the address of SPI1D to 0x0055 in the Ta bl e 4- 2.
Updated the RI
DD
in the Table A -7 .
Updated the t
RTI
in the Tabl e A-12 for MC9S08ACxx.
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