Datasheet

Electrical Characteristics
MC9S08GT16A/GT8A Data Sheet, Rev. 1
260 Freescale Semiconductor
A.4 Thermal Characteristics
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take P
I/O
into account in power calculations, determine the difference between
actual pin voltage and V
SS
or V
DD
and multiply by the pin current for each I/O pin. Except in cases of
unusually high pin current (heavy loads), the difference between pin voltage and V
SS
or V
DD
will be very
small.
Table A-2. Absolute Maximum Ratings
Rating Symbol Value Unit
Supply voltage
V
DD
–0.3 to +3.8 V
Maximum current into V
DD
I
DD
120 mA
Digital input voltage
V
In
–0.3 to V
DD
+ 0.3
V
Instantaneous maximum current
Single pin limit (applies to all port pins)
1
,
2
,
3
1
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive (V
DD
) and negative (V
SS
) clamp
voltages, then use the larger of the two resistance values.
2
All functional non-supply pins are internally clamped to V
SS
and V
DD
.
3
Power supply must maintain regulation within operating V
DD
range during instantaneous and
operating maximum current conditions. If positive injection current (V
In
> V
DD
) is greater than
I
DD
, the injection current may flow out of V
DD
and could result in external power supply going
out of regulation. Ensure external V
DD
load will shunt current greater than maximum injection
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low which would reduce overall power
consumption.
I
D
± 25 mA
Storage temperature range
T
stg
–55 to 150 °C
Maximum junction temperature T
J
150 °C