Datasheet

Chapter 1 Device Overview
MC9S08GB60A Data Sheet, Rev. 2
18 Freescale Semiconductor
1.2.2 Features of MC9S08GBxxA/GTxxA Series of MCUs
• On-chip in-circuit programmable flash memory:
— Fully read/write functional across voltage and temperature ranges
— Block protection and security options
— (see Table 1-1 for device-specific information)
• On-chip random-access memory (RAM) (see Table 1-1 for device specific information)
• 8-channel, 10-bit analog-to-digital converter (ATD)
• Two serial communications interface modules (SCI)
• Serial peripheral interface module (SPI)
• Multiple clock source options:
— Internally generated clock with ±0.2% trimming resolution and ±0.5% deviation across voltage
—Crystal
— Resonator
— External clock
• Inter-integrated circuit bus module to operate up to 100 kbps (IIC)
• One 3-channel and one 5-channel 16-bit timer/pulse width modulator (TPM) modules with
selectable input capture, output compare, and edge-aligned PWM capability on each channel. Each
timer module may be configured for buffered, centered PWM (CPWM) on all channels (TPMx).
• 8-pin keyboard interrupt module (KBI)
• 16 high-current pins (limited by package dissipation)
• Software selectable pullups on ports when used as input. Selection is on an individual port bit basis.
During output mode, pullups are disengaged.
• Internal pullup on RESET and IRQ pin to reduce customer system cost
• Up to 56 general-purpose input/output (I/O) pins, depending on package selection
• 64-pin low-profile quad flat package (LQFP) — MC9S08GBxxA
• 48-pin quad flat package, no lead (QFN) — MC9S08GTxxA
• 44-pin quad flat package (QFP) — MC9S08GTxxA
• 42-pin skinny dual in-line package (SDIP) — MC9S08GTxxA