Datasheet

Package Information
MC9S08LG32 Series Data Sheet, Rev. 9
Freescale Semiconductor 39
3.1 Device Numbering System
Example of the device numbering system:
Figure 31. Device Number Example for Auto Parts
Figure 32. Device Number Example for IMM Parts
4 Package Information
4.1 Mechanical Drawings
The following pages are mechanical drawings for the packages described in Table 23. For the latest
available drawings please visit our web site (http://www.freescale.com) and enter the package’s document
number into the keyword search box.
Table 23. Package Descriptions
Pin Count Package Type Abbreviation Designator Case No. Document No.
80 Low Quad Flat Package LQFP LK 917A 98ASS23237W
64 Low Quad Flat Package LQFP LH 840F 98ASS23234W
48 Low Quad Flat Package LQFP LF 932 98ASH00962A
S
Temperature range
Family
Memory
Core
(C = –40 C to 85C)
(9 = FLASH-based)
9
S08
X
Package designator (see Ta ble 2 3)
Approximate Flash size in KB
LG
32 J0
XX
Status/Partnumber Type
(S = Maskset specific partnumber)
Maskset Identifier Suffix
(First digit usually references wafer fab
Second digit usually differentiates mask rev)
(V = –40 C to 105C)
MC
Temperature range
Family
Memory
Status
Core
(C = –40 C to 85C)
(9 = FLASH-based)
9
S08
XX
(MC = Fully Qualified)
Package designator (see Tabl e 2 3)
Approximate Flash size in KB
LG
32 C