Datasheet

Ordering Information
MC9S08QB8 Series MCU Data Sheet, Rev. 3
Freescale Semiconductor 25
4 Ordering Information
This section contains ordering information for the device numbering system.
Example of the device numbering system:
5 Package Information
5.1 Mechanical Drawings
The following pages are mechanical drawings for the packages described in Table 18.
Table 18. Package Descriptions
Pin Count Package Type Abbreviation Designator Case No. Document No.
28 Small Outline Integrated Circuit SOIC WL 751F 98ASB42345B
24 Quad Flat Non-Leaded QFN GK 1982-01 98ARL10608D
16 Thin Shrink Small Outline Package TSSOP TG 948F 98ASH70247A
MC
Temperature range
Family
Memory
Status
Core
(C = –40 °C to 85 °C)
(9 = Flash-based)
9
S08
XX
(MC = Fully Qualified)
Package designator (see Ta ble 18 )
Approximate flash size in KB
QB
8C