Datasheet

MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Freescale Semiconductor 289
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering information for MC9S08QG8 and MC9S08QG4 devices.
B.1.1 Device Numbering Scheme
B.2 Mechanical Drawings
The following pages are mechanical specifications for MC9S08QG8/4 package options. See Table B-2 for
the document number for each package type.
Table B-1. Device Numbering System
Device Number
1
1
See Tab l e 1- 1 for a complete description of modules included on each device.
Memory Available Packages
2
2
See Tab l e B- 2 for package information.
FLASH RAM 24-Pin 16-Pin 8-Pin
MC9S08QG8 8K 512 24 QFN
16 PDIP
16 QFN
16 TSSOP
8 DFN
8 NB SOIC
MC9S08QG4 4K 256 24 QFN
16 QFN
16 TSSOP
8 DFN
8 PDIP
8 NB SOIC
Table B-2. Package Information
Pin Count Type Designator Document No.
24 QFN FK 98ARL10605D
16 PDIP PB 98ASB42431B
16 QFN FF 98ARE10614D
16 TSSOP DT 98ASH70247A
MC
Temperature range
Family
Memory
Status
Core
(C = –40°C to +85°C)
(9 = FLASH-based)
E9
S08
QG XX
RoHS compliance indicator (E = yes)
(MC = Fully Qualified)
X
Package designator (see Tabl e B- 2)
8
Memory Size (in Kbytes)
(M = –40°C to +125°C)
(4)
4M77B
1
.
1
Only maskset 4M77B has this additional number.