Datasheet

Mechanical Drawings
MC9S08SF4 Series MCU Data Sheet, Rev. 4
Freescale Semiconductor 23
4 Ordering Information
This section contains ordering information for the device numbering system.
Example of the device numbering system:
5 Package Information
5.1 Mechanical Drawings
The following pages are mechanical drawings for the packages described in Table 14. For the latest
available drawings, please visit our web site (http://www.freescale.com) and enter the package’s document
number into the keyword search box.
Table 14. Package Descriptions
Pin Count Package Type Abbreviation Designator Case No. Document No.
20 Thin Shrink Small Outline Package TSSOP TJ 948E 98ASH70169A
16 Thin Shrink Small Outline Package TSSOP TG 948F 98ASH70247A
SFMC
Temperature range
Family
Memory
Status
Core
(M= –40 C to 125 C)
(9 = Flash-based)
9
S08
XX
(MC = Fully Qualified)
Package designator (see Ta bl e 1 4)
Approximate flash size in kbytes
4X
(V = –40 C to 105 C)
(C = –40 C to 85 C)