Datasheet
Table Of Contents
- MC9S08SH8DS_Readme
- MC9S08SH8_DSAD_Rev.1
- MC9S08SH8
- Chapter 1 Device Overview
- Chapter 2 Pins and Connections
- Chapter 3 Modes of Operation
- Chapter 4 Memory
- Chapter 5 Resets, Interrupts, and General System Control
- 5.1 Introduction
- 5.2 Features
- 5.3 MCU Reset
- 5.4 Computer Operating Properly (COP) Watchdog
- 5.5 Interrupts
- 5.6 Low-Voltage Detect (LVD) System
- 5.7 Reset, Interrupt, and System Control Registers and Control Bits
- 5.7.1 Interrupt Pin Request Status and Control Register (IRQSC)
- 5.7.2 System Reset Status Register (SRS)
- 5.7.3 System Background Debug Force Reset Register (SBDFR)
- 5.7.4 System Options Register 1 (SOPT1)
- 5.7.5 System Options Register 2 (SOPT2)
- 5.7.6 System Device Identification Register (SDIDH, SDIDL)
- 5.7.7 System Power Management Status and Control 1 Register (SPMSC1)
- 5.7.8 System Power Management Status and Control 2 Register (SPMSC2)
- Chapter 6 Parallel Input/Output Control
- 6.1 Port Data and Data Direction
- 6.2 Pull-up, Slew Rate, and Drive Strength
- 6.3 Ganged Output
- 6.4 Pin Interrupts
- 6.5 Pin Behavior in Stop Modes
- 6.6 Parallel I/O and Pin Control Registers
- 6.6.1 Port A Registers
- 6.6.1.1 Port A Data Register (PTAD)
- 6.6.1.2 Port A Data Direction Register (PTADD)
- 6.6.1.3 Port A Pull Enable Register (PTAPE)
- 6.6.1.4 Port A Slew Rate Enable Register (PTASE)
- 6.6.1.5 Port A Drive Strength Selection Register (PTADS)
- 6.6.1.6 Port A Interrupt Status and Control Register (PTASC)
- 6.6.1.7 Port A Interrupt Pin Select Register (PTAPS)
- 6.6.1.8 Port A Interrupt Edge Select Register (PTAES)
- 6.6.2 Port B Registers
- 6.6.2.1 Port B Data Register (PTBD)
- 6.6.2.2 Port B Data Direction Register (PTBDD)
- 6.6.2.3 Port B Pull Enable Register (PTBPE)
- 6.6.2.4 Port B Slew Rate Enable Register (PTBSE)
- 6.6.2.5 Port B Drive Strength Selection Register (PTBDS)
- 6.6.2.6 Port B Interrupt Status and Control Register (PTBSC)
- 6.6.2.7 Port B Interrupt Pin Select Register (PTBPS)
- 6.6.2.8 Port B Interrupt Edge Select Register (PTBES)
- 6.6.3 Port C Registers
- 6.6.1 Port A Registers
- Chapter 7 Central Processor Unit (S08CPUV2)
- 7.1 Introduction
- 7.2 Programmer’s Model and CPU Registers
- 7.3 Addressing Modes
- 7.4 Special Operations
- 7.5 HCS08 Instruction Set Summary
- Chapter 8 Analog Comparator 5-V (S08ACMPV2)
- Chapter 9 Analog-to-Digital Converter (S08ADCV1)
- 9.1 Introduction
- 9.2 External Signal Description
- 9.3 Register Definition
- 9.3.1 Status and Control Register 1 (ADCSC1)
- 9.3.2 Status and Control Register 2 (ADCSC2)
- 9.3.3 Data Result High Register (ADCRH)
- 9.3.4 Data Result Low Register (ADCRL)
- 9.3.5 Compare Value High Register (ADCCVH)
- 9.3.6 Compare Value Low Register (ADCCVL)
- 9.3.7 Configuration Register (ADCCFG)
- 9.3.8 Pin Control 1 Register (APCTL1)
- 9.3.9 Pin Control 2 Register (APCTL2)
- 9.3.10 Pin Control 3 Register (APCTL3)
- 9.4 Functional Description
- 9.5 Initialization Information
- 9.6 Application Information
- Chapter 10 Internal Clock Source (S08ICSV2)
- 10.1 Introduction
- 10.2 External Signal Description
- 10.3 Register Definition
- 10.4 Functional Description
- Chapter 11 Inter-Integrated Circuit (S08IICV2)
- Chapter 12 Modulo Timer (S08MTIMV1)
- Chapter 13 Real-Time Counter (S08RTCV1)
- Chapter 14 Serial Communications Interface (S08SCIV4)
- Chapter 15 Serial Peripheral Interface (S08SPIV3)
- Chapter 16 Timer Pulse-Width Modulator (S08TPMV3)
- Chapter 17 Development Support
- 17.1 Introduction
- 17.2 Background Debug Controller (BDC)
- 17.3 On-Chip Debug System (DBG)
- 17.4 Register Definition
- 17.4.1 BDC Registers and Control Bits
- 17.4.2 System Background Debug Force Reset Register (SBDFR)
- 17.4.3 DBG Registers and Control Bits
- 17.4.3.1 Debug Comparator A High Register (DBGCAH)
- 17.4.3.2 Debug Comparator A Low Register (DBGCAL)
- 17.4.3.3 Debug Comparator B High Register (DBGCBH)
- 17.4.3.4 Debug Comparator B Low Register (DBGCBL)
- 17.4.3.5 Debug FIFO High Register (DBGFH)
- 17.4.3.6 Debug FIFO Low Register (DBGFL)
- 17.4.3.7 Debug Control Register (DBGC)
- 17.4.3.8 Debug Trigger Register (DBGT)
- 17.4.3.9 Debug Status Register (DBGS)
- Appendix A Electrical Characteristics
- A.1 Introduction
- A.2 Parameter Classification
- A.3 Absolute Maximum Ratings
- A.4 Thermal Characteristics
- A.5 ESD Protection and Latch-Up Immunity
- A.6 DC Characteristics
- A.7 Supply Current Characteristics
- A.8 External Oscillator (XOSC) Characteristics
- A.9 Internal Clock Source (ICS) Characteristics
- A.10 Analog Comparator (ACMP) Electricals
- A.11 ADC Characteristics
- A.12 AC Characteristics
- A.13 FLASH Specifications
- A.14 EMC Performance
- Appendix B Ordering Information and Mechanical Drawings
Chapter 9 Analog-to-Digital Converter (S08ADCV1)
MC9S08SH8 MCU Series Data Sheet, Rev. 3
122 Freescale Semiconductor
9.1.2 Alternate Clock
The ADC module is capable of performing conversions using the MCU bus clock, the bus clock divided
by two, the local asynchronous clock (ADACK) within the module, or the alternate clock, ALTCLK. The
alternate clock for the MC9S08SH8 MCU devices is the external reference clock (ICSERCLK).
The selected clock source must run at a frequency such that the ADC conversion clock (ADCK) runs at a
frequency within its specified range (f
ADCK
) after being divided down from the ALTCLK input as
determined by the ADIV bits.
ALTCLK is active while the MCU is in wait mode provided the conditions described above are met. This
allows ALTCLK to be used as the conversion clock source for the ADC while the MCU is in wait mode.
ALTCLK cannot be used as the ADC conversion clock source while the MCU is in either stop2 or stop3.
9.1.3 Hardware Trigger
The ADC hardware trigger, ADHWT, is the output from the real time counter (RTC). The RTC counter
can be clocked by either ICSERCLK, ICSIRCLK or a nominal 1 kHz clock source.
The period of the RTC is determined by the input clock frequency, the RTCPS bits, and the RTCMOD
register. When the ADC hardware trigger is enabled, a conversion is initiated upon an RTC counter
overflow. The RTIE does not have to be set for RTC to cause a hardware trigger.
The RTC can be configured to cause a hardware trigger in MCU run, wait, and stop3.
9.1.4 Temperature Sensor
To use the on-chip temperature sensor, the user must perform the following:
• Configure ADC for long sample with a maximum of 1 MHz clock
• Convert the bandgap voltage reference channel (AD27)
— By converting the digital value of the bandgap voltage reference channel using the value of
V
BG
the user can determine V
DD
. For value of bandgap voltage, see Section A.6, “DC
Characteristics”.
• Convert the temperature sensor channel (AD26)
— By using the calculated value of V
DD
, convert the digital value of AD26 into a voltage, V
TEMP
Equation 9-1 provides an approximate transfer function of the on-chip temperature sensor for V
DD
= 5.0V,
Temp = 25°C, using the ADC1 at f
ADCK
= 1.0MHz and configured for long sample.
Temp
C
= 25 - ( (V
TEMP
-V
TEMP25
) / m) Eqn. 9-1
where:
—V
TEMP
is the voltage of the temperature sensor channel at the ambient temperature.
—V
TEMP25
is the voltage of the temperature sensor channel at 25°C.
— m is the hot or cold voltage versus temperature slope in V/°C.
For temperature calculations, use the V
TEMP25
and m values in the data sheet.