Datasheet
Table Of Contents
- MC9S08SH8DS_Readme
- MC9S08SH8_DSAD_Rev.1
- MC9S08SH8
- Chapter 1 Device Overview
- Chapter 2 Pins and Connections
- Chapter 3 Modes of Operation
- Chapter 4 Memory
- Chapter 5 Resets, Interrupts, and General System Control
- 5.1 Introduction
- 5.2 Features
- 5.3 MCU Reset
- 5.4 Computer Operating Properly (COP) Watchdog
- 5.5 Interrupts
- 5.6 Low-Voltage Detect (LVD) System
- 5.7 Reset, Interrupt, and System Control Registers and Control Bits
- 5.7.1 Interrupt Pin Request Status and Control Register (IRQSC)
- 5.7.2 System Reset Status Register (SRS)
- 5.7.3 System Background Debug Force Reset Register (SBDFR)
- 5.7.4 System Options Register 1 (SOPT1)
- 5.7.5 System Options Register 2 (SOPT2)
- 5.7.6 System Device Identification Register (SDIDH, SDIDL)
- 5.7.7 System Power Management Status and Control 1 Register (SPMSC1)
- 5.7.8 System Power Management Status and Control 2 Register (SPMSC2)
- Chapter 6 Parallel Input/Output Control
- 6.1 Port Data and Data Direction
- 6.2 Pull-up, Slew Rate, and Drive Strength
- 6.3 Ganged Output
- 6.4 Pin Interrupts
- 6.5 Pin Behavior in Stop Modes
- 6.6 Parallel I/O and Pin Control Registers
- 6.6.1 Port A Registers
- 6.6.1.1 Port A Data Register (PTAD)
- 6.6.1.2 Port A Data Direction Register (PTADD)
- 6.6.1.3 Port A Pull Enable Register (PTAPE)
- 6.6.1.4 Port A Slew Rate Enable Register (PTASE)
- 6.6.1.5 Port A Drive Strength Selection Register (PTADS)
- 6.6.1.6 Port A Interrupt Status and Control Register (PTASC)
- 6.6.1.7 Port A Interrupt Pin Select Register (PTAPS)
- 6.6.1.8 Port A Interrupt Edge Select Register (PTAES)
- 6.6.2 Port B Registers
- 6.6.2.1 Port B Data Register (PTBD)
- 6.6.2.2 Port B Data Direction Register (PTBDD)
- 6.6.2.3 Port B Pull Enable Register (PTBPE)
- 6.6.2.4 Port B Slew Rate Enable Register (PTBSE)
- 6.6.2.5 Port B Drive Strength Selection Register (PTBDS)
- 6.6.2.6 Port B Interrupt Status and Control Register (PTBSC)
- 6.6.2.7 Port B Interrupt Pin Select Register (PTBPS)
- 6.6.2.8 Port B Interrupt Edge Select Register (PTBES)
- 6.6.3 Port C Registers
- 6.6.1 Port A Registers
- Chapter 7 Central Processor Unit (S08CPUV2)
- 7.1 Introduction
- 7.2 Programmer’s Model and CPU Registers
- 7.3 Addressing Modes
- 7.4 Special Operations
- 7.5 HCS08 Instruction Set Summary
- Chapter 8 Analog Comparator 5-V (S08ACMPV2)
- Chapter 9 Analog-to-Digital Converter (S08ADCV1)
- 9.1 Introduction
- 9.2 External Signal Description
- 9.3 Register Definition
- 9.3.1 Status and Control Register 1 (ADCSC1)
- 9.3.2 Status and Control Register 2 (ADCSC2)
- 9.3.3 Data Result High Register (ADCRH)
- 9.3.4 Data Result Low Register (ADCRL)
- 9.3.5 Compare Value High Register (ADCCVH)
- 9.3.6 Compare Value Low Register (ADCCVL)
- 9.3.7 Configuration Register (ADCCFG)
- 9.3.8 Pin Control 1 Register (APCTL1)
- 9.3.9 Pin Control 2 Register (APCTL2)
- 9.3.10 Pin Control 3 Register (APCTL3)
- 9.4 Functional Description
- 9.5 Initialization Information
- 9.6 Application Information
- Chapter 10 Internal Clock Source (S08ICSV2)
- 10.1 Introduction
- 10.2 External Signal Description
- 10.3 Register Definition
- 10.4 Functional Description
- Chapter 11 Inter-Integrated Circuit (S08IICV2)
- Chapter 12 Modulo Timer (S08MTIMV1)
- Chapter 13 Real-Time Counter (S08RTCV1)
- Chapter 14 Serial Communications Interface (S08SCIV4)
- Chapter 15 Serial Peripheral Interface (S08SPIV3)
- Chapter 16 Timer Pulse-Width Modulator (S08TPMV3)
- Chapter 17 Development Support
- 17.1 Introduction
- 17.2 Background Debug Controller (BDC)
- 17.3 On-Chip Debug System (DBG)
- 17.4 Register Definition
- 17.4.1 BDC Registers and Control Bits
- 17.4.2 System Background Debug Force Reset Register (SBDFR)
- 17.4.3 DBG Registers and Control Bits
- 17.4.3.1 Debug Comparator A High Register (DBGCAH)
- 17.4.3.2 Debug Comparator A Low Register (DBGCAL)
- 17.4.3.3 Debug Comparator B High Register (DBGCBH)
- 17.4.3.4 Debug Comparator B Low Register (DBGCBL)
- 17.4.3.5 Debug FIFO High Register (DBGFH)
- 17.4.3.6 Debug FIFO Low Register (DBGFL)
- 17.4.3.7 Debug Control Register (DBGC)
- 17.4.3.8 Debug Trigger Register (DBGT)
- 17.4.3.9 Debug Status Register (DBGS)
- Appendix A Electrical Characteristics
- A.1 Introduction
- A.2 Parameter Classification
- A.3 Absolute Maximum Ratings
- A.4 Thermal Characteristics
- A.5 ESD Protection and Latch-Up Immunity
- A.6 DC Characteristics
- A.7 Supply Current Characteristics
- A.8 External Oscillator (XOSC) Characteristics
- A.9 Internal Clock Source (ICS) Characteristics
- A.10 Analog Comparator (ACMP) Electricals
- A.11 ADC Characteristics
- A.12 AC Characteristics
- A.13 FLASH Specifications
- A.14 EMC Performance
- Appendix B Ordering Information and Mechanical Drawings
Appendix A Electrical Characteristics
MC9S08SH8 MCU Series Data Sheet, Rev. 3
Freescale Semiconductor 303
A.9 Internal Clock Source (ICS) Characteristics
Table A-9. ICS Frequency Specification (Temperature Range = –40 to 125°C Ambient)
Nu
m
C Rating Symbol Min Typical Max Unit
1P
Internal reference frequency - factory trimmed
at V
DD
= 5 V and temperature = 25°C
f
int_ft
— 31.25 — kHz
2P
Internal reference frequency - untrimmed
1
1
TRIM register at default value (0x80) and FTRIM control bit at default value (0x0).
f
int_ut
25 36 41.66 kHz
3 P Internal reference frequency - user trimmed
f
int_t
31.25 — 39.0625 kHz
4 D Internal reference startup time
t
irefst
— 55 100 μs
5—
DCO output frequency range - untrimmed
1
value provided for reference: f
dco_ut
= 1024 × f
int_ut
f
dco_ut
25.6 36.86 42.66 MHz
6 D DCO output frequency range - trimmed
f
dco_t
32 — 40 MHz
7D
Resolution of trimmed DCO output frequency at fixed
voltage and temperature (using FTRIM)
Δf
dco_res_t
— ± 0.1 ± 0.2
%f
dco
8D
Resolution of trimmed DCO output frequency at fixed
voltage and temperature (not using FTRIM)
Δf
dco_res_t
— ± 0.2 ± 0.4
%f
dco
9D
Total deviation from actual trimmed DCO output
frequency over voltage and temperature
Δf
dco_t
—
+ 0.5
– 1.0
± 2
%f
dco
10 D
Total deviation of trimmed DCO output frequency over
fixed voltage and temperature range of 0
°C to 70 °C
Δf
dco_t
— ± 0.5 ± 1
%f
dco
11 D
FLL acquisition time
2
2
This specification applies to any time the FLL reference source or reference divider is changed, trim value changed or changing
from FLL disabled (FBELP, FBILP) to FLL enabled (FEI, FEE, FBE, FBI). If a crystal/resonator is being used as the reference,
this specification assumes it is already running.
t
acquire
1ms
12 D
DCO output clock long term jitter (over 2mS interval)
3
3
Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f
BUS
.
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the FLL circuitry via V
DD
and V
SS
and variation in crystal oscillator frequency increase the C
Jitter
percentage for a
given interval.
C
Jitter
— 0.02 0.2
%f
dco