Datasheet
Table Of Contents
- MC9S08SH8DS_Readme
- MC9S08SH8_DSAD_Rev.1
- MC9S08SH8
- Chapter 1 Device Overview
- Chapter 2 Pins and Connections
- Chapter 3 Modes of Operation
- Chapter 4 Memory
- Chapter 5 Resets, Interrupts, and General System Control
- 5.1 Introduction
- 5.2 Features
- 5.3 MCU Reset
- 5.4 Computer Operating Properly (COP) Watchdog
- 5.5 Interrupts
- 5.6 Low-Voltage Detect (LVD) System
- 5.7 Reset, Interrupt, and System Control Registers and Control Bits
- 5.7.1 Interrupt Pin Request Status and Control Register (IRQSC)
- 5.7.2 System Reset Status Register (SRS)
- 5.7.3 System Background Debug Force Reset Register (SBDFR)
- 5.7.4 System Options Register 1 (SOPT1)
- 5.7.5 System Options Register 2 (SOPT2)
- 5.7.6 System Device Identification Register (SDIDH, SDIDL)
- 5.7.7 System Power Management Status and Control 1 Register (SPMSC1)
- 5.7.8 System Power Management Status and Control 2 Register (SPMSC2)
- Chapter 6 Parallel Input/Output Control
- 6.1 Port Data and Data Direction
- 6.2 Pull-up, Slew Rate, and Drive Strength
- 6.3 Ganged Output
- 6.4 Pin Interrupts
- 6.5 Pin Behavior in Stop Modes
- 6.6 Parallel I/O and Pin Control Registers
- 6.6.1 Port A Registers
- 6.6.1.1 Port A Data Register (PTAD)
- 6.6.1.2 Port A Data Direction Register (PTADD)
- 6.6.1.3 Port A Pull Enable Register (PTAPE)
- 6.6.1.4 Port A Slew Rate Enable Register (PTASE)
- 6.6.1.5 Port A Drive Strength Selection Register (PTADS)
- 6.6.1.6 Port A Interrupt Status and Control Register (PTASC)
- 6.6.1.7 Port A Interrupt Pin Select Register (PTAPS)
- 6.6.1.8 Port A Interrupt Edge Select Register (PTAES)
- 6.6.2 Port B Registers
- 6.6.2.1 Port B Data Register (PTBD)
- 6.6.2.2 Port B Data Direction Register (PTBDD)
- 6.6.2.3 Port B Pull Enable Register (PTBPE)
- 6.6.2.4 Port B Slew Rate Enable Register (PTBSE)
- 6.6.2.5 Port B Drive Strength Selection Register (PTBDS)
- 6.6.2.6 Port B Interrupt Status and Control Register (PTBSC)
- 6.6.2.7 Port B Interrupt Pin Select Register (PTBPS)
- 6.6.2.8 Port B Interrupt Edge Select Register (PTBES)
- 6.6.3 Port C Registers
- 6.6.1 Port A Registers
- Chapter 7 Central Processor Unit (S08CPUV2)
- 7.1 Introduction
- 7.2 Programmer’s Model and CPU Registers
- 7.3 Addressing Modes
- 7.4 Special Operations
- 7.5 HCS08 Instruction Set Summary
- Chapter 8 Analog Comparator 5-V (S08ACMPV2)
- Chapter 9 Analog-to-Digital Converter (S08ADCV1)
- 9.1 Introduction
- 9.2 External Signal Description
- 9.3 Register Definition
- 9.3.1 Status and Control Register 1 (ADCSC1)
- 9.3.2 Status and Control Register 2 (ADCSC2)
- 9.3.3 Data Result High Register (ADCRH)
- 9.3.4 Data Result Low Register (ADCRL)
- 9.3.5 Compare Value High Register (ADCCVH)
- 9.3.6 Compare Value Low Register (ADCCVL)
- 9.3.7 Configuration Register (ADCCFG)
- 9.3.8 Pin Control 1 Register (APCTL1)
- 9.3.9 Pin Control 2 Register (APCTL2)
- 9.3.10 Pin Control 3 Register (APCTL3)
- 9.4 Functional Description
- 9.5 Initialization Information
- 9.6 Application Information
- Chapter 10 Internal Clock Source (S08ICSV2)
- 10.1 Introduction
- 10.2 External Signal Description
- 10.3 Register Definition
- 10.4 Functional Description
- Chapter 11 Inter-Integrated Circuit (S08IICV2)
- Chapter 12 Modulo Timer (S08MTIMV1)
- Chapter 13 Real-Time Counter (S08RTCV1)
- Chapter 14 Serial Communications Interface (S08SCIV4)
- Chapter 15 Serial Peripheral Interface (S08SPIV3)
- Chapter 16 Timer Pulse-Width Modulator (S08TPMV3)
- Chapter 17 Development Support
- 17.1 Introduction
- 17.2 Background Debug Controller (BDC)
- 17.3 On-Chip Debug System (DBG)
- 17.4 Register Definition
- 17.4.1 BDC Registers and Control Bits
- 17.4.2 System Background Debug Force Reset Register (SBDFR)
- 17.4.3 DBG Registers and Control Bits
- 17.4.3.1 Debug Comparator A High Register (DBGCAH)
- 17.4.3.2 Debug Comparator A Low Register (DBGCAL)
- 17.4.3.3 Debug Comparator B High Register (DBGCBH)
- 17.4.3.4 Debug Comparator B Low Register (DBGCBL)
- 17.4.3.5 Debug FIFO High Register (DBGFH)
- 17.4.3.6 Debug FIFO Low Register (DBGFL)
- 17.4.3.7 Debug Control Register (DBGC)
- 17.4.3.8 Debug Trigger Register (DBGT)
- 17.4.3.9 Debug Status Register (DBGS)
- Appendix A Electrical Characteristics
- A.1 Introduction
- A.2 Parameter Classification
- A.3 Absolute Maximum Ratings
- A.4 Thermal Characteristics
- A.5 ESD Protection and Latch-Up Immunity
- A.6 DC Characteristics
- A.7 Supply Current Characteristics
- A.8 External Oscillator (XOSC) Characteristics
- A.9 Internal Clock Source (ICS) Characteristics
- A.10 Analog Comparator (ACMP) Electricals
- A.11 ADC Characteristics
- A.12 AC Characteristics
- A.13 FLASH Specifications
- A.14 EMC Performance
- Appendix B Ordering Information and Mechanical Drawings
Chapter 4 Memory
MC9S08SH8 MCU Series Data Sheet, Rev. 3
Freescale Semiconductor 47
4.5.1 Features
Features of the FLASH memory include:
• FLASH size
— MC9S08SH8: 8,192 bytes (16 pages of 512 bytes each)
— MC9S08SH4: 4,096 bytes (8 pages of 512 bytes each)
• Single power supply program and erase
• Command interface for fast program and erase operation
• Up to 100,000 program/erase cycles at typical voltage and temperature
• Flexible block protection
• Security feature for FLASH and RAM
• Auto power-down for low-frequency read accesses
4.5.2 Program and Erase Times
Before any program or erase command can be accepted, the FLASH clock divider register (FCDIV) must
be written to set the internal clock for the FLASH module to a frequency (f
FCLK
) between 150 kHz and
200 kHz (see Section 4.7.1, “FLASH Clock Divider Register (FCDIV)”). This register can be written only
once, so normally this write is done during reset initialization. FCDIV cannot be written if the access error
flag, FACCERR in FSTAT, is set. The user must ensure that FACCERR is not set before writing to the
FCDIV register. One period of the resulting clock (1/f
FCLK
) is used by the command processor to time
program and erase pulses. An integer number of these timing pulses are used by the command processor
to complete a program or erase command.
Table 4-5 shows program and erase times. The bus clock frequency and FCDIV determine the frequency
of FCLK (f
FCLK
). The time for one cycle of FCLK is t
FCLK
= 1/f
FCLK
. The times are shown as a number
of cycles of FCLK and as an absolute time for the case where t
FCLK
=5μs. Program and erase times
shown include overhead for the command state machine and enabling and disabling of program and erase
voltages.
Table 4-5. Program and Erase Times
Parameter Cycles of FCLK Time if FCLK = 200 kHz
Byte program 9 45 μs
Byte program (burst) 4 20 μs
1
1
Excluding start/end overhead
Page erase 4000 20 ms
Mass erase 20,000 100 ms
