Datasheet
Table Of Contents
- MC9S08SH8DS_Readme
- MC9S08SH8_DSAD_Rev.1
- MC9S08SH8
- Chapter 1 Device Overview
- Chapter 2 Pins and Connections
- Chapter 3 Modes of Operation
- Chapter 4 Memory
- Chapter 5 Resets, Interrupts, and General System Control
- 5.1 Introduction
- 5.2 Features
- 5.3 MCU Reset
- 5.4 Computer Operating Properly (COP) Watchdog
- 5.5 Interrupts
- 5.6 Low-Voltage Detect (LVD) System
- 5.7 Reset, Interrupt, and System Control Registers and Control Bits
- 5.7.1 Interrupt Pin Request Status and Control Register (IRQSC)
- 5.7.2 System Reset Status Register (SRS)
- 5.7.3 System Background Debug Force Reset Register (SBDFR)
- 5.7.4 System Options Register 1 (SOPT1)
- 5.7.5 System Options Register 2 (SOPT2)
- 5.7.6 System Device Identification Register (SDIDH, SDIDL)
- 5.7.7 System Power Management Status and Control 1 Register (SPMSC1)
- 5.7.8 System Power Management Status and Control 2 Register (SPMSC2)
- Chapter 6 Parallel Input/Output Control
- 6.1 Port Data and Data Direction
- 6.2 Pull-up, Slew Rate, and Drive Strength
- 6.3 Ganged Output
- 6.4 Pin Interrupts
- 6.5 Pin Behavior in Stop Modes
- 6.6 Parallel I/O and Pin Control Registers
- 6.6.1 Port A Registers
- 6.6.1.1 Port A Data Register (PTAD)
- 6.6.1.2 Port A Data Direction Register (PTADD)
- 6.6.1.3 Port A Pull Enable Register (PTAPE)
- 6.6.1.4 Port A Slew Rate Enable Register (PTASE)
- 6.6.1.5 Port A Drive Strength Selection Register (PTADS)
- 6.6.1.6 Port A Interrupt Status and Control Register (PTASC)
- 6.6.1.7 Port A Interrupt Pin Select Register (PTAPS)
- 6.6.1.8 Port A Interrupt Edge Select Register (PTAES)
- 6.6.2 Port B Registers
- 6.6.2.1 Port B Data Register (PTBD)
- 6.6.2.2 Port B Data Direction Register (PTBDD)
- 6.6.2.3 Port B Pull Enable Register (PTBPE)
- 6.6.2.4 Port B Slew Rate Enable Register (PTBSE)
- 6.6.2.5 Port B Drive Strength Selection Register (PTBDS)
- 6.6.2.6 Port B Interrupt Status and Control Register (PTBSC)
- 6.6.2.7 Port B Interrupt Pin Select Register (PTBPS)
- 6.6.2.8 Port B Interrupt Edge Select Register (PTBES)
- 6.6.3 Port C Registers
- 6.6.1 Port A Registers
- Chapter 7 Central Processor Unit (S08CPUV2)
- 7.1 Introduction
- 7.2 Programmer’s Model and CPU Registers
- 7.3 Addressing Modes
- 7.4 Special Operations
- 7.5 HCS08 Instruction Set Summary
- Chapter 8 Analog Comparator 5-V (S08ACMPV2)
- Chapter 9 Analog-to-Digital Converter (S08ADCV1)
- 9.1 Introduction
- 9.2 External Signal Description
- 9.3 Register Definition
- 9.3.1 Status and Control Register 1 (ADCSC1)
- 9.3.2 Status and Control Register 2 (ADCSC2)
- 9.3.3 Data Result High Register (ADCRH)
- 9.3.4 Data Result Low Register (ADCRL)
- 9.3.5 Compare Value High Register (ADCCVH)
- 9.3.6 Compare Value Low Register (ADCCVL)
- 9.3.7 Configuration Register (ADCCFG)
- 9.3.8 Pin Control 1 Register (APCTL1)
- 9.3.9 Pin Control 2 Register (APCTL2)
- 9.3.10 Pin Control 3 Register (APCTL3)
- 9.4 Functional Description
- 9.5 Initialization Information
- 9.6 Application Information
- Chapter 10 Internal Clock Source (S08ICSV2)
- 10.1 Introduction
- 10.2 External Signal Description
- 10.3 Register Definition
- 10.4 Functional Description
- Chapter 11 Inter-Integrated Circuit (S08IICV2)
- Chapter 12 Modulo Timer (S08MTIMV1)
- Chapter 13 Real-Time Counter (S08RTCV1)
- Chapter 14 Serial Communications Interface (S08SCIV4)
- Chapter 15 Serial Peripheral Interface (S08SPIV3)
- Chapter 16 Timer Pulse-Width Modulator (S08TPMV3)
- Chapter 17 Development Support
- 17.1 Introduction
- 17.2 Background Debug Controller (BDC)
- 17.3 On-Chip Debug System (DBG)
- 17.4 Register Definition
- 17.4.1 BDC Registers and Control Bits
- 17.4.2 System Background Debug Force Reset Register (SBDFR)
- 17.4.3 DBG Registers and Control Bits
- 17.4.3.1 Debug Comparator A High Register (DBGCAH)
- 17.4.3.2 Debug Comparator A Low Register (DBGCAL)
- 17.4.3.3 Debug Comparator B High Register (DBGCBH)
- 17.4.3.4 Debug Comparator B Low Register (DBGCBL)
- 17.4.3.5 Debug FIFO High Register (DBGFH)
- 17.4.3.6 Debug FIFO Low Register (DBGFL)
- 17.4.3.7 Debug Control Register (DBGC)
- 17.4.3.8 Debug Trigger Register (DBGT)
- 17.4.3.9 Debug Status Register (DBGS)
- Appendix A Electrical Characteristics
- A.1 Introduction
- A.2 Parameter Classification
- A.3 Absolute Maximum Ratings
- A.4 Thermal Characteristics
- A.5 ESD Protection and Latch-Up Immunity
- A.6 DC Characteristics
- A.7 Supply Current Characteristics
- A.8 External Oscillator (XOSC) Characteristics
- A.9 Internal Clock Source (ICS) Characteristics
- A.10 Analog Comparator (ACMP) Electricals
- A.11 ADC Characteristics
- A.12 AC Characteristics
- A.13 FLASH Specifications
- A.14 EMC Performance
- Appendix B Ordering Information and Mechanical Drawings
Chapter 2 Pins and Connections
MC9S08SH8 MCU Series Data Sheet, Rev. 3
26 Freescale Semiconductor
2.2.2 Oscillator (XOSC)
Immediately after reset, the MCU uses an internally generated clock provided by the clock source
generator (ICS) module. For more information on the ICS, see Chapter 10, “Internal Clock Source
(S08ICSV2).”
The oscillator (XOSC) in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic
resonator. Rather than a crystal or ceramic resonator, an external oscillator can be connected to the EXTAL
input pin.
Refer to Figure 2-5 for the following discussion. R
S
(when used) and R
F
should be low-inductance
resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
R
F
is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup; its value
is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity and
lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when selecting C1 and C2. The crystal manufacturer typically specifies a load capacitance
which is the series combination of C1 and C2 (which are usually the same size). As a first-order
approximation, use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin
(EXTAL and XTAL).
2.2.3 RESET
After a power-on reset (POR), the PTA5/IRQ/TCLK/RESET pin defaults to a general-purpose I/O port
pin, PTA5. Setting RSTPE in SOPT1 configures the pin to be the
RESET pin with an open-drain drive
containing an internal pull-up device. After configured as
RESET, the pin will remain RESET until the
next POR. The
RESET pin when enabled can be used to reset the MCU from an external source when the
pin is driven low.
Internal power-on reset and low-voltage reset circuitry typically make external reset circuitry unnecessary.
This pin is normally connected to the standard 6-pin background debug connector so a development
system can directly reset the MCU system. If desired, a manual external reset can be added by supplying
a simple switch to ground (pull reset pin low to force a reset).
Whenever any non-POR reset is initiated (whether from an external signal or from an internal system), the
RESET pin if enabled is driven low for about 66 bus cycles. The reset circuitry decodes the cause of reset
and records it by setting a corresponding bit in the system reset status register (SRS).
NOTE
This pin does not contain a clamp diode to V
DD
and should not be driven
above V
DD
.