Datasheet
Table Of Contents
- MC9S08SH8DS_Readme
- MC9S08SH8_DSAD_Rev.1
- MC9S08SH8
- Chapter 1 Device Overview
- Chapter 2 Pins and Connections
- Chapter 3 Modes of Operation
- Chapter 4 Memory
- Chapter 5 Resets, Interrupts, and General System Control
- 5.1 Introduction
- 5.2 Features
- 5.3 MCU Reset
- 5.4 Computer Operating Properly (COP) Watchdog
- 5.5 Interrupts
- 5.6 Low-Voltage Detect (LVD) System
- 5.7 Reset, Interrupt, and System Control Registers and Control Bits
- 5.7.1 Interrupt Pin Request Status and Control Register (IRQSC)
- 5.7.2 System Reset Status Register (SRS)
- 5.7.3 System Background Debug Force Reset Register (SBDFR)
- 5.7.4 System Options Register 1 (SOPT1)
- 5.7.5 System Options Register 2 (SOPT2)
- 5.7.6 System Device Identification Register (SDIDH, SDIDL)
- 5.7.7 System Power Management Status and Control 1 Register (SPMSC1)
- 5.7.8 System Power Management Status and Control 2 Register (SPMSC2)
- Chapter 6 Parallel Input/Output Control
- 6.1 Port Data and Data Direction
- 6.2 Pull-up, Slew Rate, and Drive Strength
- 6.3 Ganged Output
- 6.4 Pin Interrupts
- 6.5 Pin Behavior in Stop Modes
- 6.6 Parallel I/O and Pin Control Registers
- 6.6.1 Port A Registers
- 6.6.1.1 Port A Data Register (PTAD)
- 6.6.1.2 Port A Data Direction Register (PTADD)
- 6.6.1.3 Port A Pull Enable Register (PTAPE)
- 6.6.1.4 Port A Slew Rate Enable Register (PTASE)
- 6.6.1.5 Port A Drive Strength Selection Register (PTADS)
- 6.6.1.6 Port A Interrupt Status and Control Register (PTASC)
- 6.6.1.7 Port A Interrupt Pin Select Register (PTAPS)
- 6.6.1.8 Port A Interrupt Edge Select Register (PTAES)
- 6.6.2 Port B Registers
- 6.6.2.1 Port B Data Register (PTBD)
- 6.6.2.2 Port B Data Direction Register (PTBDD)
- 6.6.2.3 Port B Pull Enable Register (PTBPE)
- 6.6.2.4 Port B Slew Rate Enable Register (PTBSE)
- 6.6.2.5 Port B Drive Strength Selection Register (PTBDS)
- 6.6.2.6 Port B Interrupt Status and Control Register (PTBSC)
- 6.6.2.7 Port B Interrupt Pin Select Register (PTBPS)
- 6.6.2.8 Port B Interrupt Edge Select Register (PTBES)
- 6.6.3 Port C Registers
- 6.6.1 Port A Registers
- Chapter 7 Central Processor Unit (S08CPUV2)
- 7.1 Introduction
- 7.2 Programmer’s Model and CPU Registers
- 7.3 Addressing Modes
- 7.4 Special Operations
- 7.5 HCS08 Instruction Set Summary
- Chapter 8 Analog Comparator 5-V (S08ACMPV2)
- Chapter 9 Analog-to-Digital Converter (S08ADCV1)
- 9.1 Introduction
- 9.2 External Signal Description
- 9.3 Register Definition
- 9.3.1 Status and Control Register 1 (ADCSC1)
- 9.3.2 Status and Control Register 2 (ADCSC2)
- 9.3.3 Data Result High Register (ADCRH)
- 9.3.4 Data Result Low Register (ADCRL)
- 9.3.5 Compare Value High Register (ADCCVH)
- 9.3.6 Compare Value Low Register (ADCCVL)
- 9.3.7 Configuration Register (ADCCFG)
- 9.3.8 Pin Control 1 Register (APCTL1)
- 9.3.9 Pin Control 2 Register (APCTL2)
- 9.3.10 Pin Control 3 Register (APCTL3)
- 9.4 Functional Description
- 9.5 Initialization Information
- 9.6 Application Information
- Chapter 10 Internal Clock Source (S08ICSV2)
- 10.1 Introduction
- 10.2 External Signal Description
- 10.3 Register Definition
- 10.4 Functional Description
- Chapter 11 Inter-Integrated Circuit (S08IICV2)
- Chapter 12 Modulo Timer (S08MTIMV1)
- Chapter 13 Real-Time Counter (S08RTCV1)
- Chapter 14 Serial Communications Interface (S08SCIV4)
- Chapter 15 Serial Peripheral Interface (S08SPIV3)
- Chapter 16 Timer Pulse-Width Modulator (S08TPMV3)
- Chapter 17 Development Support
- 17.1 Introduction
- 17.2 Background Debug Controller (BDC)
- 17.3 On-Chip Debug System (DBG)
- 17.4 Register Definition
- 17.4.1 BDC Registers and Control Bits
- 17.4.2 System Background Debug Force Reset Register (SBDFR)
- 17.4.3 DBG Registers and Control Bits
- 17.4.3.1 Debug Comparator A High Register (DBGCAH)
- 17.4.3.2 Debug Comparator A Low Register (DBGCAL)
- 17.4.3.3 Debug Comparator B High Register (DBGCBH)
- 17.4.3.4 Debug Comparator B Low Register (DBGCBL)
- 17.4.3.5 Debug FIFO High Register (DBGFH)
- 17.4.3.6 Debug FIFO Low Register (DBGFL)
- 17.4.3.7 Debug Control Register (DBGC)
- 17.4.3.8 Debug Trigger Register (DBGT)
- 17.4.3.9 Debug Status Register (DBGS)
- Appendix A Electrical Characteristics
- A.1 Introduction
- A.2 Parameter Classification
- A.3 Absolute Maximum Ratings
- A.4 Thermal Characteristics
- A.5 ESD Protection and Latch-Up Immunity
- A.6 DC Characteristics
- A.7 Supply Current Characteristics
- A.8 External Oscillator (XOSC) Characteristics
- A.9 Internal Clock Source (ICS) Characteristics
- A.10 Analog Comparator (ACMP) Electricals
- A.11 ADC Characteristics
- A.12 AC Characteristics
- A.13 FLASH Specifications
- A.14 EMC Performance
- Appendix B Ordering Information and Mechanical Drawings
Chapter 4 Memory
MC9S08SH8 MCU Series Data Sheet, Rev. 3
46 Freescale Semiconductor
4.4 RAM
The MC9S08SH8 includes static RAM. The locations in RAM below 0x0100 can be accessed using the
more efficient direct addressing mode, and any single bit in this area can be accessed with the bit
manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed
program variables in this area of RAM is preferred.
The RAM retains data when the MCU is in low-power wait, stop2, or stop3 mode. At power-on the
contents of RAM are uninitialized. RAM data is unaffected by any reset provided that the supply voltage
does not drop below the minimum value for RAM retention (V
RAM
).
For compatibility with M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the
MC9S08SH8, it is usually best to reinitialize the stack pointer to the top of the RAM so the direct page
RAM can be used for frequently accessed RAM variables and bit-addressable program variables. Include
the following 2-instruction sequence in your reset initialization routine (where RamLast is equated to the
highest address of the RAM in the Freescale Semiconductor-provided equate file).
LDHX #RamLast+1 ;point one past RAM
TXS ;SP<-(H:X-1)
When security is enabled, the RAM is considered a secure memory resource and is not accessible through
BDM or through code executing from non-secure memory. See Section 4.6, “Security”, for a detailed
description of the security feature.
4.5 FLASH
The FLASH memory is intended primarily for program storage. In-circuit programming allows the
operating program to be loaded into the FLASH memory after final assembly of the application product.
It is possible to program the entire array through the single-wire background debug interface. Because no
special voltages are needed for FLASH erase and programming operations, in-application programming
is also possible through other software-controlled communication paths. For a more detailed discussion of
in-circuit and in-application programming, refer to the HCS08 Family Reference Manual, Volume I,
Freescale Semiconductor document order number HCS08RMv1/D.