Datasheet

Appendix B Ordering Information and Mechanical Drawings
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
Freescale Semiconductor 355
Appendix B
Ordering Information and Mechanical Drawings
B.1 Ordering Information
This section contains ordering information for MC9S08EL32 Series and MC9S08SL16 Series devices.
B.1.1 Device Numbering Scheme
This device uses a smart numbering system. Refer to the following diagram to understand what each
element of the device number represents.
Figure B-1. MC9S08EL32 and MC9S08SL16 Device Numbering Scheme
Table B-1. Devices in the MC9S08EL32 Series and MC9S08SL16 Series
Device Number
1
1
See Table 1-1 for a complete description of modules included on each device.
Memory
Available Packages
2
2
See Ta bl e B -2 for package information.
FLASH RAM EEPROM
MC9S08EL32 32,768
1024 512
28-TSSOP, 20-TSSOP
MC9S08EL16 16,384
MC9S08SL16 16,384
512 256
MC9S08SL8 8,192
S9S08ELn E1 C xx R
Status
- S = Auto Qualified
Main Memory Type
- 9 = Flash-based
Core
Family
- EL or SL
Memory Size
- 32 Kbytes
- 16 Kbytes
Mask Set Identifier — this
field only appears in “Auto
Qualified” part numbers
- Alpha character references
wafer fab.
- Numeric character identifies
mask.
Temperature Option
- C = –40 to 85 °C
- V = –40 to 105 °C
- M = –40 to 125 °C
Package Designator
Two letter descriptor (refer to
Ta bl e B -2).
Tape and Reel Suffix (optional)
- R = Tape and Reel