Datasheet

MC9S12DT128B Device User Guide — V01.09
calculations refer to Section A.1.8 Power Dissipation and Thermal
Characteristics.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
J
)in°C can be
obtained from:
Table A-4 Operating Conditions
Rating Symbol Min Typ Max Unit
I/O, Regulator and Analog Supply Voltage
V
DD5
4.5 5 5.25 V
Digital Logic Supply Voltage
1
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external
source.
V
DD
2.35 2.5 2.75 V
PLL Supply Voltage
2
V
DDPLL
2.25 2.5 2.75 V
Voltage Difference VDDX to VDDR and VDDA
VDDX
-0.1 0 0.1 V
Voltage Difference VSSX to VSSR and VSSA
VSSX
-0.1 0 0.1 V
Oscillator
f
osc
0.5 - 16 MHz
Bus Frequency
f
bus
0.5 - 25 MHz
MC9S12DT128BC
Operating Junction Temperature Range
T
J
-40 - 100 °C
Operating Ambient Temperature Range
2
2. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela-
tion between ambient temperature T
A
and device junction temperature T
J
.
T
A
-40 27 85 °C
MC9S12DT128BV
Operating Junction Temperature Range
T
J
-40 - 120 °C
Operating Ambient Temperature Range
2
T
A
-40 27 105 °C
MC9S12DT128BM
Operating Junction Temperature Range
T
J
-40 - 140 °C
Operating Ambient Temperature Range
2
T
A
-40 27 125 °C
T
J
T
A
P
D
Θ
JA
()+=
T
J
Junction Temperature, [°C ]=
T
A
Ambient Temperature, [°C ]=
Freescale Semiconductor, I
Freescale Semiconductor, Inc.
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